LM4918LQ/NOPB National Semiconductor, LM4918LQ/NOPB Datasheet - Page 11

• Manufacturer Part Number: LM4918LQ/NOPB
• Description: IC AMP AUDIO PWR 1.1W STER 32LLP
• Manufacturer: National Semiconductor
• Series: Boomer®r
• Type: Class ABr

Specifications of LM4918LQ/NOPB

• Output Type: 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 1.1W x 2 @ 8 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Mute, Shutdown, Thermal Protection, Volume Control
• Mounting Type: Surface Mount
• Package / Case: 32-LLP
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Output Power (typ): 1.1x2@8OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.3@8Ohm@1W%
• Single Supply Voltage (typ): 3/5V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 67dB
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Package Type: LLP EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LM4918LQ

Application Information
mize thermal design may compromise the LM4918’s perfor-
mance and activate unwanted, though necessary, thermal
shutdown protection.
The LM4918LD must have its DAP soldered to a copper pad
on the PCB. The DAP’s PCB copper pad is then, ideally,
connected to a large plane of continuous unbroken copper.
This plane forms a thermal mass, heat sink, and radiation
area. Place the heat sink area on either outside plane in the
case of a two-sided or multi-layer PCB. (The heat sink area
can also be placed on an inner layer of a multi-layer board.
The thermal resistance, however, will be higher.) Connect
the DAP copper pad to the inner layer or backside copper
heat sink area with 2 vias. The via diameter should be
0.012in - 0.013in with a 1.27mm pitch. Ensure efficient ther-
mal conductivity by plugging and tenting the vias with plating
and solder mask, respectively. Further detailed and specific
information concerning PCB layout, fabrication, and mount-
ing an LQ (LLP) package is available in National Semicon-
ductor’s AN1187.
FIGURE 2. REFERENCE DESIGN BOARD SCHEMATIC
(Continued)
11
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is
critical for low noise performance and high power supply
rejection. Applications that employ a 5V regulator typically
use a 10µF in parallel with a 0.1µF filter capacitors to stabi-
lize the regulator’s output, reduce noise on the supply line,
and improve the supply’s transient response. However, their
presence does not eliminate the need for a local 1.0µF
tantalum bypass capacitance connected between the
LM4918’s supply pins and ground. Keep the length of leads
and traces that connect capacitors between the LM4918’s
power supply pin and ground as short as possible. Connect-
ing a 2.2µF capacitor, C
ground improves the internal bias voltage’s stability and
improves the amplifier’s PSRR. The PSRR improvements
increase as the bypass pin capacitor value increases. Too
large, however, increases turn-on time and can compromise
the amplifier’s click and pop performance. The selection of
bypass capacitor values, especially C
PSRR requirements, click and pop performance system
cost, and size constraints.
B
, between the BYPASS pin and
B
, depends on desired
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