LT1190CS8 Linear Technology, LT1190CS8 Datasheet - Page 11
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LT1190CS8
Manufacturer Part Number
LT1190CS8
Description
IC OP-AMP VIDEO HISPD SNGL 8SOIC
Manufacturer
Linear Technology
Datasheet
1.LT1190CN8.pdf
(12 pages)
Specifications of LT1190CS8
Applications
General Purpose
Number Of Circuits
1
Slew Rate
450 V/µs
Current - Supply
32mA
Current - Output / Channel
50mA
Voltage - Supply, Single/dual (±)
4.75 V ~ 16 V, ±2.38 V ~ 8 V
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LT1190CS8
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
LT1190CS8#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
LT1190CS8#TRPBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
SI PLIFIED SCHE ATIC
PACKAGE DESCRIPTIO
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
W
OR TIN PLATE LEADS
(0.203 – 0.457)
SHDN
0.008 – 0.018
5
(0.762 BSC)
0.300 BSC
*SUBSTRATE DIODE, DO NOT FORWARD BIAS
–
+
3
2
0 – 15
(1.143 – 1.727)
0.045 – 0.068
(1.143 – 1.651)
(0.360 – 0.660)
FULL LEAD
0.045 – 0.065
W
0.014 – 0.026
OPTION
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
BAL
1
CORNER LEADS OPTION
U
(4 PLCS)
BAL
V
8
8-Lead CERDIP (Narrow 0.300, Hermetic)
BIAS
Dimensions in inches (millimeters) unless otherwise noted.
(0.584 – 1.143)
0.023 – 0.045
OBSOLETE PACKAGE
HALF LEAD
OPTION
(LTC DWG # 05-08-1110)
V
BIAS
J8 Package
+V
(0.381 – 1.524)
(2.54)
0.100
0.015 – 0.060
BSC
C
(5.080)
FF
0.200
0.125
3.175
MAX
+V
MIN
C
M
RAD TYP
(0.635)
0.025
(0.127)
0.005
MIN
8
1
(10.287)
7
2
0.405
MAX
6
3
*
LT1190 • TA14
5
4
7
6
4
LT1190
V
V
V
(5.588 – 7.874)
0.220 – 0.310
+
OUT
–
J8 1298
11