TSL1018IF STMicroelectronics, TSL1018IF Datasheet - Page 2

IC BUFFER 18+1CH TFT-LCD 48-TQFP

TSL1018IF

Manufacturer Part Number
TSL1018IF
Description
IC BUFFER 18+1CH TFT-LCD 48-TQFP
Manufacturer
STMicroelectronics
Datasheet

Specifications of TSL1018IF

Applications
TFT-LCD Panels: Gamma Buffer, VCOM Driver
Number Of Circuits
18
-3db Bandwidth
3.5MHz
Slew Rate
1.1 V/µs
Current - Supply
8mA
Current - Output / Channel
150mA
Voltage - Supply, Single/dual (±)
5.5 V ~ 16.8 V
Mounting Type
Surface Mount
Package / Case
48-TQFP Exposed Pad, 48-eTQFP, 48-HTQFP, 48-VQFP
Operating Supply Voltage
5.5 V to 16.8 V
Maximum Power Dissipation
3470 mW
Maximum Operating Temperature
+ 95 C
Maximum Supply Current
11 mA
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Quantity
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Part Number:
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Manufacturer:
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Part Number:
TSL1018IF
Manufacturer:
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Part Number:
TSL1018IFT
Manufacturer:
STMicroelectronics
Quantity:
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Part Number:
TSL1018IFT
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Absolute maximum ratings and operating conditions
1
2/15
Absolute maximum ratings and operating conditions
Table 1.
1. P
2. Human body model: a 100pF capacitor is charged to the specified voltage, then discharged through a
3. Machine model: a 200pF capacitor is charged to the specified voltage, then discharged directly between
4. Charged device model: all pins and package are charged together to the specified voltage and then
Table 2.
Symbol
Symbol
R
T
T
1.5kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations
while the other pins are floating.
two pins of the device with no external series resistor (internal resistor < 5Ω). This is done for all couples of
connected pin combinations while the other pins are floating.
discharged directly to the ground through only one pin.
T
I
ESD
V
V
V
V
OUT
LEAD
THJA
P
STG
D
amb
T
DD
CC
IN
IN
D
J
is calculated with T
Supply voltage (V
Ambient temperature
Input voltages for buffers A & B
Input voltages for buffers C to R & COM
Supply voltage
Input voltage
Output current (A to R buffers)
Output current (COM buffer)
Thermal resistance junction to ambient for TQFP48
Power dissipation
Lead temperature (soldering 10 seconds)
Storage temperature
Junction temperature
Human body model (HBM)
Machine model (MM)
Charged device model (CDM)
Absolute maximum ratings
Operating conditions
ePad not thermally connected to PCB
ePad thermally connected to PCB
ePad not thermally connected to PCB
ePad thermally connected to PCB
amb
= 25°C, T
DD
(1)
for TQFP48 ePad
- V
Parameter
(3)
Parameter
J
SS
= 150°C and R
)
(2)
(4)
THJA
.
V
SS
V
V
-0.5V to V
SS
SS
-65 to +150
5.5 to 16.8
-40 to +95
+ 1.5V to V
to V
Value
Value
1470
3470
2000
1500
150
260
150
200
18
40
85
36
DD
DD
- 1.5V
+0.5V
DD
TSL1018
°C/W
Unit
Unit
mW
mA
°C
°C
°C
°C
V
V
V
V
V

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