GSM850 ETC ETC, GSM850 Datasheet
GSM850
Related parts for GSM850
GSM850 Summary of contents
Page 1
... ASICs and other power control circuitry; this allows the module to be driven directly from the DAC out- put. The device is designed for use as the final RF ampli- fier in GSM850, EGSM900, DCS and PCS handheld digital cellular equipment and other applications in the 824MHz to 849MHz, 880MHz to 915MHz, 1710MHz to 1785MHz and 1850MHz to 1910MHz bands ...
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RF3140 Absolute Maximum Ratings Parameter Supply Voltage Power Control Voltage (V ) RAMP Input RF Power Max Duty Cycle Output Load VSWR Operating Case Temperature Storage Temperature Parameter Min. Overall Power Control V RAMP Power Control “ON” Power Control “OFF” ...
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... Parameter Min. Overall (GSM850 Mode) Operating Frequency Range Maximum Output Power +34.2 Total Efficiency Input Power Range Output Noise Power Forward Isolation 1 Forward Isolation 2 Cross Band Isolation Second Harmonic Third Harmonic All Other Non-Harmonic Spurious Input Impedance Input VSWR Output Load VSWR Stability ...
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RF3140 Parameter Min. Overall (GSM900 Mode) Operating Frequency Range Maximum Output Power +34.2 Total Efficiency Input Power Range Output Noise Power Forward Isolation 1 Forward Isolation 2 Cross Band Isolation 2f 0 Second Harmonic Third Harmonic All Other Non-Harmonic Spurious ...
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Parameter Min. Overall (DCS Mode) Operating Frequency Range Maximum Output Power +29.5 Total Efficiency Input Power Range Output Noise Power Forward Isolation 1 Forward Isolation 2 Second Harmonic Third Harmonic All Other Non-Harmonic Spurious Input Impedance Input VSWR Output Load ...
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RF3140 Parameter Min. Overall (PCS Mode) Operating Frequency Range Maximum Output Power +29.5 Total Efficiency Input Power Range Output Noise Power Forward Isolation 1 Forward Isolation 2 Second Harmonic Third Harmonic All Other Non-Harmonic Spurious Input Impedance Input VSWR Output ...
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... Controlled voltage input to driver stage for GSM bands. This voltage is part of the power control function for the module. This node must be connected GSM850/GS RF output for the GSM bands. This is a 50Ω output. The output load line matching is contained internal to the package. M900 OUT ...
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... RF3140 PIN #1 DCS/PCS IN BAND SELECT TX EN VBATT VREG VRAMP GSM850/GSM900 IN 2-498 Pin Out DCS/PCS OUT VCC OUT GSM850/GSM900 OUT 10.0000 10.0000 Rev A6 040113 ...
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... Overview The RF3140 is a quad-band GSM850, EGSM900, DCS1800, and PCS1900 power amplifier module that incorporates an indirect closed loop method of power control. This simplifies the phone design by eliminating the need for the complicated control loop design. The indirect closed loop appears as an open loop to the user and can be driven directly from the DAC output in the baseband circuit ...
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RF3140 Where P is the output power from the PA insertion loss, P the input power to the PA and P IN the delivered DC power. The RF3140 improves the effective efficiency by mini- mizing the P term ...
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Power control loop stability often presents many chal- lenges to transmitter design. Designing a proper power control loop involves trade-offs affecting stability, tran- sient spectrum and burst timing. In conventional architectures the PA gain (dB/ V) varies across different power ...
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RF3140 From DAC *Shaded area eliminated with Indirect Closed Loop using RF3140 2-502 Rev A6 040113 ...
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... Used to filter noise and spurious from base band. Note 1: All the PA output measurements are referenced to the PA output pad (Pin 11 and 9). Note 2: The 50 Ω microstrip between the PA output pad and the SMA connector has an approximate insertion loss of 0.1 dB for GSM850/EGSM900 and 0.2 dB for DCS1800/PCS1900 bands. Rev A6 040113 ...
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RF3140 Board Thickness 0.032”, Board Material FR-4, Multi-Layer 2-504 Evaluation Board Layout Board Size 2.0” x 2.0” Rev A6 040113 ...
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PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3µinch to 8µinch gold over 180µinch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when ...
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RF3140 Thermal Pad and Via Design The PCB land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively ...