ADD8704ACPZ-R2 Analog Devices Inc, ADD8704ACPZ-R2 Datasheet - Page 14

• Manufacturer Part Number: ADD8704ACPZ-R2
• Description: IC OPAMP LCD QUAD 16V 16LFCSP
• Manufacturer: Analog Devices Inc

Specifications of ADD8704ACPZ-R2

• Applications: TFT-LCD Panels: Gamma Buffer, VCOM Driver
• Number Of Circuits: 4
• -3db Bandwidth: 6.8MHz
• Slew Rate: 6 V/µs
• Current - Supply: 2.8mA
• Current - Output / Channel: 35mA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 16 V
• Mounting Type: Surface Mount
• Package / Case: 16-LFCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADD8704
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADD8704ARU
ADD8704ARU-REEL
ADD8704ARUZ
ADD8704ARUZ-REEL
ADD8704ACPZ-R2
ADD8704ACPZ-REEL7
1
Z = Pb-free part.
1
1
1
1
INDICATOR
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
1.00
0.85
0.80
PIN 1
1.05
1.00
0.80
12° MAX
Figure 39. 16-Terminal Leadless Frame Chip Scale Package [LFCSP] (CP)
SEATING
PLANE
4.50
4.40
4.30
PIN 1
Figure 38. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU)
BSC SQ
0.15
0.05
14
VIEW
TOP
4.0
1
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
0.65
BSC
COMPLIANT TO JEDEC STANDARDS MO-153AB-1
0.80 MAX
0.65 TYP
0.30
0.19
5.10
5.00
4.90
0.35
0.28
0.25
Dimensions shown in millimeters
Dimensions shown in millimeters
BSC SQ
0.20 REF
8
7
SEATING
PLANE
3.75
Rev. 0 | Page 14 of 16
6.40
BSC
0.05 MAX
0.02 NOM
1.20
MAX
Package Description
14-Lead Thin Shrink SOIC
14-Lead Thin Shrink SOIC
14-Lead Thin Shrink SOIC
14-Lead Thin Shrink SOIC
16-Terminal Leadless Frame Chip Scale
16-Terminal Leadless Frame Chip Scale
COPLANARITY
0.60 MAX
0.65 BSC
COPLANARITY
0.20
0.09
0.10
0.75
0.60
0.50
0.08
8°
0°
12
9
13
8
0.60 MAX
BO TTOM
VIEW
16
5
1
1.95 BSC
4
0.75
0.60
0.45
2.25
2.10 SQ
1.95
0.25 MIN
PIN 1
INDICATOR
Package Option
RU-14
RU-14
RU-14
RU-14
CP-16
CP-16