1-1926732-8 TE Connectivity, 1-1926732-8 Datasheet - Page 4

• Manufacturer Part Number: 1-1926732-8
• Manufacturer: TE Connectivity

Specifications of 1-1926732-8

• Pcb Mount Alignment: Without
• Pcb Mount Retention: With
• Pcb Mounting Orientation: Right Angle
• Make First / Break Last: Yes
• Product Line: MINIPAK HDL
• Ul File Number: E28476
• Termination Method To Pc Board: Through Hole - Press Fit
• Sealed: No
• Number Of Power Positions: 8
• Operating Voltage Reference: AC
• Operating Voltage (vac): 250
• Hot Pluggable: No
• Tail Length (mm [in]): 3.3 [0.13]
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 8.00 [0.315]
• Number Of Signal Positions: 25
• Number Of Positions: 33
• Pcb Mount Retention Type: Screw Mount
• Selectively Loaded: Yes
• Centerline (mm [in]): 2.00 [0.079]
• Centerline, Power Contacts (mm [in]): 2.75 [0.108]
• Underplate Material Thickness (µm [?in]): 1.27 [50.000]
• Length (x-axis) (mm [in]): 46.21 [1.820]
• Width (z-axis) (mm [in]): 32.50 [1.2795]
• Number Of Rows: 1
• Mating Retention: Without
• Tail Plating Material: Bright Tin-Lead
• Contact Type: Pin
• Contact Base Material: Copper
• Contact Plating, Mating Area, Material: Gold or Palladium Nickel or Performance Based
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.762 [30]
• Tail Plating, Thickness (µm [?in]): 0.5 [20]
• Underplate Material: Nickel
• Contact Design: Single Beam
• Connector Style: Plug
• Mating Alignment: With
• Housing Material: Crystal Polymer
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Mating Alignment Type: Passive Guide
• Connector Contact Configuration (no. Of Pos./type): 25/Signal, 8/AC Power
• Custom Configurable: No
• Rohs/elv Compliance: RoHS/Not ELV Compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS not ELV compliant
• Agency/standard: UL, CSA
• Ul Rating: Recognized
• Ul Voltage Rating (vac): 250
• Csa Certified: Yes
• Operating Temperature (°c [°f]): -40 – +125 [-40 – +257]
• Pcb Thickness, Recommended (mm [in]): 1.40 [0.055]
• Applies To: Printed Circuit Board
• Board-to-board Configuration: Co-Planar
• Contact Transmits (typical Application): Signal (Data)/ Power
• Application Use: Board-to-Board
• Pick And Place Cover: Without
• Packaging Method: Tray

Tem perature rise vs current, power
contacts.
Random vibration.
Mechanical shock.
Durability.
Mating force.
Unm ating force.
Com pliant pin insertion.
Com pliant pin retention.
Rev B
Test Description
50 C m axim um tem perature rise.
No discontinuities of 1 m icrosecond
or longer duration.
See Note.
No discontinuities of 1 m icrosecond
or longer duration.
See Note.
See Note.
3 N m axim um for power contact.
Average m ating force for signal
contacts shall be less than 1.65 N
per contact.
0.5 N m inim um per power contact.
0.15 N m inim um per signal contact.
44.5 N m axim um per pin.
10 N m inim um per pin.
Figure 3 (continued)
MECHANICAL
Requirem ent
EIA-364-70, Method 1.
Stabilize at a single current level
until 3 readings at 5 m inute intervals
are within 1 C. Test with single
energized contact and with 2, 4, 8,
12 and 24 adjacent power contacts
energized.
Record data over a range 20 to
50 C tem perature rise.
Docum ent 30 C tem perature rise
current.
EIA-364-28, Test Condition VII,
Condition E.
Subject m ated specim ens to 4.90
G's rm s between 20 to 500 Hz.
Fifteen m inutes in each of 3
m utually perpendicular planes.
EIA-364-27, Condition A.
Subject m ated specim ens to 50 G's
half-sine shock pulses of 11
m illiseconds duration. Three shocks
in each direction applied along 3
m utually perpendicular planes, 18
total shocks.
EIA-364-9.
Mate and unm ate specim ens for
250 cycles at a m axim um rate of
500 cycles per hour.
EIA-364-13.
Measure force necessary to m ate
specim ens at a m axim um rate of
12.7 m m per m inute.
EIA-364-13.
Measure force necessary to unm ate
specim ens at a m axim um rate of
12.7 m m per m inute.
Tyco Electronics 109-41.
Measure force necessary to
correctly apply a specim en to a
PCB at a m axim um rate of 12.7 m m
per m inute.
Tyco Electronics 109-30-1.
Measure force necessary to rem ove
a correctly applied specim en from
its PCB at a m axim um rate of 12.7
m m per m inute.
Procedure
108-2325
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