AD7606-4 Analog Devices, AD7606-4 Datasheet - Page 11

• Manufacturer Part Number: AD7606-4
• Description: 4-Channel DAS with 16-Bit, Bipolar, Simultaneous Sampling ADC
• Manufacturer: Analog Devices

Specifications of AD7606-4

• Resolution (bits): 16bit
• # Chan: 4
• Sample Rate: 200kSPS
• Interface: Par,Ser,SPI
• Analog Input Type: SE-Bip
• Ain Range: Bip 10V,Bip 5.0V
• Adc Architecture: SAR
• Pkg Type: QFP

Data Sheet
ABSOLUTE MAXIMUM RATINGS
T
Table 4.
Parameter
AV
V
Analog Input Voltage to AGND
Digital Input Voltage to AGND
Digital Output Voltage to AGND
REFIN to AGND
Input Current to Any Pin Except Supplies
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Pb/SN Temperature, Soldering
Pb-Free Temperature, Soldering Reflow
ESD (All Pins Except Analog Inputs)
ESD (Analog Input Pins Only)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Transient currents of up to 100 mA do not cause SCR latch-up.
DRIVE
A
B Version
Reflow (10 sec to 30 sec)
CC
= 25°C, unless otherwise noted.
to AGND
to AGND
1
1
Rating
−0.3 V to +7 V
−0.3 V to AV
±16.5 V
−0.3 V to V
−0.3 V to V
−0.3 V to AV
±10 mA
−40°C to +85°C
−65°C to +150°C
150°C
240 (+0)°C
260 (+0)°C
2 kV
7 kV
DRIVE
DRIVE
CC
CC
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
Rev. C | Page 11 of 36
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 5. Thermal Resistance
Package Type
64-Lead LQFP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
AD7606/AD7606-6/AD7606-4
θ
45
JA
θ
11
JC
Unit
°C/W