AD7656-1 Analog Devices, AD7656-1 Datasheet - Page 10

• Manufacturer Part Number: AD7656-1
• Description: 250 kSPS, 6-Channel, Simultaneous Sampling, Bipolar 16-Bit ADC
• Manufacturer: Analog Devices

Specifications of AD7656-1

• Resolution (bits): 16bit
• # Chan: 6
• Sample Rate: 250kSPS
• Interface: Par,Ser,SPI
• Analog Input Type: SE-Bip
• Ain Range: 10V p-p,20 V p-p,Bip 10V,Bip 5.0V
• Adc Architecture: SAR
• Pkg Type: QFP

AD7656-1/AD7657-1/AD7658-1
ABSOLUTE MAXIMUM RATINGS
T
Table 5.
Parameter
V
V
V
AV
DV
DV
AGND to DGND
V
Analog Input Voltage to AGND
Digital Input Voltage to DGND
Digital Output Voltage to DGND
REFIN/REFOUT to AGND
Input Current to Any Pin Except
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Pb/Sn Temperature, Soldering
Pb-Free Temperature, Soldering Reflow
ESD
1
2
If the analog inputs are driven from alternative V
a 240 Ω series resistor should be placed on the analog inputs and Schottky
diodes should be placed in series with the V
AD7656-1/AD7657-1/AD7658-1.
Transient currents of up to 100 mA do not cause SCR latch-up.
DD
SS
DD
DRIVE
A
Supplies
B Version
Y Version
Reflow (10 sec to 30 sec)
CC
CC
CC
= 25°C, unless otherwise noted.
to AGND, DGND
to AGND, DGND
to AV
to AGND, DGND
to AV
to DGND, AGND
to DGND
CC
CC
2
1
DD
and V
DD
Rating
−0.3 V to +16.5 V
+0.3 V to −16.5 V
V
−0.3 V to +7 V
−0.3 V to AV
−0.3 V to +7 V
−0.3 V to +0.3 V
−0.3 V to DV
V
−0.3 V to V
−0.3 V to V
−0.3 V to AV
±10 mA
−40°C to +85°C
−40°C to +125°C
−65°C to +150°C
150°C
240(+0)°C
260(+0)°C
1.5 kV
CC
SS
and V
SS
− 0.3 V to V
− 0.3 V to +16.5 V
supplies of the
SS
supply circuitry,
DRIVE
DRIVE
CC
CC
CC
DD
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
Rev. C | Page 10 of 32
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 6. Thermal Resistance
Package Type
64-Lead LQFP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
45
JA
θ
11
JC
Unit
°C/W