AD7877 Analog Devices, AD7877 Datasheet - Page 44
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AD7877
Manufacturer Part Number
AD7877
Description
Touch Screen Controller
Manufacturer
Analog Devices
Datasheet
1.AD7877.pdf
(44 pages)
Specifications of AD7877
Resolution (bits)
12bit
# Chan
9
Sample Rate
125kSPS
Interface
Ser
Analog Input Type
SE-Uni
Ain Range
Uni (Vref),Uni 2.5V
Adc Architecture
SAR
Pkg Type
CSP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD7877ACBZ-REEL7
Manufacturer:
National
Quantity:
374
Company:
Part Number:
AD7877ACPZ
Manufacturer:
AMD
Quantity:
13
Company:
Part Number:
AD7877ACPZ
Manufacturer:
ADI
Quantity:
206
Part Number:
AD7877ACPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AD7877
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD7877ACPZ-REEL
AD7877ACPZ-REEL7
AD7877ACPZ-500RL7
AD7877ACBZ-REEL
AD7877ACBZ-REEL7
AD7877WACPZ-REEL7
EVAL-AD7877EBZ
1
2
AUTOMOTIVE PRODUCTS
The AD7877WACPZ models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
©2004–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
W = Qualified for Automotive Applications
1, 2
SEATING
PLANE
INDICATOR
1.00
0.85
0.80
PIN 1
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Temperature Range
(BALL SIDE DOWN)
12° MAX
BALL 1
IDENTIFIER
TOP VIEW
2.825
2.765
2.705
D03796-0-12/11(D)
BSC SQ
TOP VIEW
Figure 49. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5.00
Figure 50. 25-Ball Wafer Level Chip Scale Package [WLCSP]
0.30
0.25
0.18
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
2.605
2.545
2.485
5 mm × 5 mm Body, Very Thin Quad
Dimensions shown in millimeters
Dimensions shown in millimeters
BSC SQ
4.75
0.20 REF
2.5 mm × 2.8 mm Body
Rev. D | Page 44 of 44
0.05 MAX
0.02 NOM
COPLANARITY
(CB-25-1)
(CP-32-2)
0.08
0.280
0.240
0.200
0.60 MAX
0.650
0.590
0.530
0.50
BALL
PITCH
SEATING
PLANE
BSC
0.50
0.50
0.40
0.30
0.360
0.320
0.280
24
17
0.240
0.220
0.200
25
16
Package Description
32-Lead LFCSP_VQ
32-Lead LFCSP_VQ
32-Lead LFCSP_VQ
25-Ball WLCSP
25-Ball WLCSP
32-Lead LFCSP_VQ
Evaluation Board
BOTTOM VIEW
0.60 MAX
3.50 REF
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
5
4
BOTTOM VIEW
(BALL SIDE UP)
32
9
1
8
3
3.25
3.10 SQ
2.95
2
PIN 1
INDICATOR
0.25 MIN
1
B
C
D
E
A
Package Option
CP-32-2
CP-32-2
CP-32-2
CB-25-1
CP-32-2
CB-25-1
Data Sheet