AD9779A Analog Devices, AD9779A Datasheet - Page 9

• Manufacturer Part Number: AD9779A
• Description: Dual 16-Bit, 1 GSPS, Digital-to-Analog Converter
• Manufacturer: Analog Devices

Specifications of AD9779A

• Resolution (bits): 16bit
• Dac Update Rate: 1GSPS
• Dac Settling Time: n/a
• Max Pos Supply (v): +3.47V
• Single-supply: No
• Dac Type: Current Out
• Dac Input Format: Par

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVDD33, DVDD33
DVDD18, CVDD18
AGND
DGND
CGND
I120, VREF, IPTAT
OUT1_P, OUT1_N,
OUT2_P, OUT2_N,
AUX1_P, AUX1_N,
AUX2_P, AUX2_N
P1D[15:0], P2D[15:0]
DATACLK, TXENABLE
REFCLK+, REFCLK−
RESET, IRQ, PLL_LOCK,
SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I−,
CSB, SCLK, SDIO, SDO
Junction Temperature
Storage Temperature
Range
With Respect To
AGND, DGND,
CGND
AGND, DGND,
CGND
DGND, CGND
AGND, CGND
AGND, DGND
AGND
AGND
DGND
DGND
CGND
DGND
Rating
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to
AVDD33 + 0.3 V
−1.0 V to
AVDD33 + 0.3 V
−0.3 V to
DVDD33 + 0.3 V
−0.3 V to
DVDD33 + 0.3 V
−0.3 V to
CVDD18 + 0.3 V
−0.3 V to
DVDD33 + 0.3 V
+125°C
−65°C to +150°C
Rev. B | Page 9 of 56
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
For optimal thermal performance, the exposed paddle (EPAD)
should be soldered to the ground plane for the 100-lead,
thermally enhanced TQFP package.
Typical θ
Airflow increases heat dissipation, effectively reducing θ
Table 6. Thermal Resistance
Package Type
100-Lead TQFP
ESD CAUTION
EPAD Soldered
EPAD Not Soldered
JA
and θ
JC
are specified for a 4-layer board in still air.
AD9776A/AD9778A/AD9779A
θ
19.1
27.4
JA
θ
12.4
JB
θ
7.1
JC
JA
.
Unit
°C/W
°C/W