MAX9890BETA+T Maxim Integrated Products, MAX9890BETA+T Datasheet - Page 9

• Manufacturer Part Number: MAX9890BETA+T
• Description: IC SUPPRESSOR CLICK-POP 8TDFN-EP
• Manufacturer: Maxim Integrated Products
• Type: Audio Suppressorr

Specifications of MAX9890BETA+T

• Applications: Cell Phone
• Mounting Type: Surface Mount
• Package / Case: 8-TDFN Exposed Pad
• Product: Audio Analog Processor
• Operating Supply Voltage: 2.7 V to 5.5 V
• Supply Current: 14 uA
• Maximum Power Dissipation: 1951 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Output Power: 1.95W
• Supply Voltage Range: 2.7V To 5.5V
• Operating Temperature Range: -40°C To +85°C
• No. Of Pins: 8
• Digital Ic Case Style: TDFN
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MAX9890BETA+T; MAX9890BETA+TTR

Figure 7. Low-Frequency Attenuation for Common DC-Blocking
Capacitor Values
The external click-pop suppression capacitor at CEXT
serves a dual purpose. On power-up, C
charged by an internal current source and is used to
slowly ramp up the external coupling capacitors. When
the device is powered down, C
circuitry used to drain the external coupling capacitors.
A 0.1µF capacitor between CEXT and GND provides
clickless/popless operation with coupling capacitors for
both the MAX9890A and MAX9890B, even with the
rapid removal of supply voltage.
Good layout improves performance by decreasing the
amount of stray capacitance and noise. To decrease
stray capacitance, minimize PC board trace lengths
and resistor leads, and place external components as
close to the device as possible.
The excellent PSRR of the MAX9890 allows it to operate
from noisy power supplies. In most applications, a
0.1µF capacitor from V
bypass capacitor should be placed close to V
-12
-15
-18
-21
-24
-27
-30
-3
-6
-9
0
10
Applications Information
_______________________________________________________________________________________
Power Supply and Bypassing
LOW-FREQUENCY ROLLOFF
External Capacitor (C
100
FREQUENCY (Hz)
CC
(R
100μF
33μF
220μF
L
= 16Ω)
1k
to GND is sufficient. This
330μF
CEXT
10k
powers the internal
100k
CC
Layout
CEXT
CEXT
.
Audio Click-Pop Suppressor
is
)
For the latest application details on UCSP construction,
dimensions, tape-carrier information, printed circuit
board techniques, bump-pad layout, and recommend-
ed reflow temperature profile, as well as the latest infor-
mation on reliability testing results, refer to the
Application Note, “UCSP—A Wafer-Level Chip-Scale
Package” available on Maxim’s website at www.maxim-
ic.com/ucsp.
TRANSISTOR COUNT: 1001
PROCESS: BiCMOS
Table 1. Coupling Capacitor
*May experience some degradation of click-pop suppression.
CAPACITOR
SIZE (µF)
100
150
220
330
470
UCSP Applications Information
33
47
TURN-ON TIME
MAX9890A
(200ms)
—
—
√
√
√
*
*
Chip Information
TURN-ON TIME
MAX9890B
(300ms)
√
√
√
√
√
*
*
9