AD8073 Analog Devices, AD8073 Datasheet - Page 4

• Manufacturer Part Number: AD8073
• Description: Low Cost, Triple Video Amplifier
• Manufacturer: Analog Devices

Specifications of AD8073

• -3db Bandwidth: 100MHz
• Slew Rate: 500V/µs
• Vos: 2mV
• Ib: 4µA
• # Opamps Per Pkg: 3
• Input Noise (nv/rthz): 3nV/rtHz
• Vcc-vee: 5V to 12V
• Isy Per Amplifier: 5mA
• Packages: DIP,SOIC

AD8072/AD8073
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13.2 V
Internal Power Dissipation
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ± V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . ± 1.25 V
Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . . .
Storage Temperature Range
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C
NOTES
1
2
Model
AD8072JN
AD8072JR
AD8072JR-REEL
AD8072JR-REEL7
AD8073JN
AD8073JR
AD8073JR-REEL
AD8073JR-REEL7
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8072/AD8073 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Specification is for device in free air:
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
8-Lead Plastic Package: θ
8-Lead SOIC Package: θ
8-Lead µSOIC Package: θ
14-Lead Plastic Package: θ
14-Lead SOIC Package: θ
Brand Code: HLA
AD8072ARM
AD8072ARM-REEL –40°C to +85°C 13" Reel 8-Lead µSOIC RM-8
AD8072ARM-REEL7 –40°C to +85°C 7" Reel 8-Lead µSOIC RM-8
N, R, RM Packages . . . . . . . . . . . . . . . . . . –65°C to +125°C
AD8072 8-Lead Plastic (N) . . . . . . . . . . . . . . . . . . 1.3 Watts
AD8072 8-Lead Small Outline (SO-8) . . . . . . . . . 0.9 Watts
AD8072 8-Lead µSOIC (RM) . . . . . . . . . . . . . . . . 0.6 Watts
AD8073 14-Lead Plastic (N) . . . . . . . . . . . . . . . . . 1.6 Watts
AD8073 14-Lead Small Outline (R) . . . . . . . . . . . 1.0 Watts
. . . . . . . . . . . . . . . . . . . . . .
Temperature
Range
–40°C to +85°C 8-Lead µSOIC
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
JA
JA
ORDERING GUIDE
JA
JA
JA
= 140°C/W
= 90°C/W
= 214°C/W
= 120°C/W
= 75°C/W
2
Observe Power Derating Curves
Package
Description
8-Lead Plastic DIP
8-Lead SOIC
13" Reel 8-Lead SOIC SO-8
7" Reel 8-Lead SOIC
14-Lead Plastic DIP
14-Lead Narrow SOIC R-14
13" Reel 14-Lead SOIC R-14
7" Reel 14-Lead SOIC R-14
1
Package
Option
RM-8
N-8
SO-8
SO-8
N-14
S
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8072
and AD8073 is limited by the associated rise in junction tem-
perature. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition tem-
perature of the plastic, approximately 150°C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
While the AD8072 and AD8073 are internally short circuit pro-
tected, this may not be sufficient to guarantee that the maximum
junction temperature (150°C) is not exceeded under all condi-
tions. To ensure proper operation, it is necessary to observe the
maximum power derating curves shown in Figures 2 and 3.
2.0
1.5
1.0
0.5
2.5
2.0
1.5
1.0
0.5
–50
0
–50
–40 –30 –20 –10
–40 –30 –20 –10 0
14-LEAD SOIC
8-LEAD SOIC PACKAGE
AMBIENT TEMPERATURE – C
AMBIENT TEMPERATURE – C
8-LEAD MINI-DIP PACKAGE
SOIC
0
10 20
10 20
WARNING!
14-LEAD DIP PACKAGE
30
30 40 50
40
50 60
ESD SENSITIVE DEVICE
T
T
60
J
J
= 150 C
= 150 C
70 80
70
80
90
90