ADP121 Analog Devices, ADP121 Datasheet - Page 17

• Manufacturer Part Number: ADP121
• Description: 150 mA, Low Quiescent Current, CMOS Linear Regulator in 5-Lead TSOT or 4-Ball WLCSP
• Manufacturer: Analog Devices

Data Sheet
PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP121. How-
ever, as can be seen from Table 6 and Table 7, a point of
diminishing returns is eventually reached, beyond which
an increase in the copper size does not yield significant heat
dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use 0402 or 0603 size capacitors and
resistors to achieve the smallest possible footprint solution on
boards where area is limited.
Figure 47. WLCSP, 100 mm
Figure 46. TSOT, 100 mm
140
120
100
140
120
100
80
60
40
20
80
60
40
20
0
0
0.5
0.5
I
I
I
I
I
I
I
MAX JUNCTION TEMPERATURE
I
I
I
I
I
I
I
MAX JUNCTION TEMPERATURE
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
1.0
1.0
= 1mA
= 10mA
= 25mA
= 50mA
= 75mA
= 100mA
= 150mA
= 1mA
= 10mA
= 25mA
= 50mA
= 75mA
= 100mA
= 150mA
1.5
1.5
2
2
of PCB Copper, Board Temperature = 85°C
of PCB Copper, Board Temperature = 85°C
2.0
2.0
V
V
IN
IN
– V
– V
2.5
2.5
OUT
OUT
(V)
(V)
3.0
3.0
3.5
3.5
4.0
4.0
4.5
4.5
Rev. E | Page 17 of 20
GND
GND
VIN
Figure 50. Example of WLCSP PCB Layout—Bottom Side
Figure 49. Example of WLCSP PCB Layout—Top Side
Figure 48. Example of TSOT PCB Layout
J1
EN
ANALOG DEVICES
ADP121-xx-EVALZ
C1
U1
C2
ADP121
VOUT
GND
GND