ADP3334 Analog Devices, ADP3334 Datasheet
ADP3334
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ADP3334 Summary of contents
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... This device also includes a safety current limit, ther- mal overload protection, and a shutdown feature. In shutdown mode, the ground current is reduced to less than 1 µA. The ADP3334 has low quiescent current of 90 µA (typical) in light load situations. REV. B Information furnished by Analog Devices is believed to be accurate and reliable ...
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... ADP3334–SPECIFICATIONS Parameter OUTPUT 4 Voltage Accuracy 4 Line Regulation Load Regulation Dropout Voltage Peak Load Current Output Noise 5 GROUND CURRENT In Regulation In Dropout In Shutdown SHUTDOWN Threshold Voltage SD Input Current Output Current in Shutdown NOTES 1 All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC) methods. ...
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... ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADP3334 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality ...
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... ADP3334–Typical Performance Characteristics 2.202 V = 2.2V OUT 2.201 L 2.200 2.199 150mA 2.198 2.197 300mA 2.196 2.195 500mA 2.194 INPUT VOLTAGE – V TPC 1. Line Regulation Output Voltage vs. Supply Voltage 5 2.2V OUT 4.0 3.0 2.0 1 100 200 300 400 500 OUTPUT LOAD – mA TPC 4 ...
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... L NOISE REDUCTION 0mA WITH NOISE REDUCTION – TPC 17. RMS Noise vs ( 100 kHz) –5– ADP3334 2.3 2.2 2.1 400 200 V = 2.2V OUT 200 400 600 800 TIME – s TPC 12. Load Transient Response ...
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... LDOs more difficult because of their unclear specifications and extreme variations over temperature. With the ADP3334 anyCAP LDO, this is no longer true. It can be used with virtually any good quality capacitor, with no con- straint on the minimum ESR. This innovative design allows the circuit to be stable with just a small 1 mF capacitor on the out- put ...
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... Thermal Overload Protection The ADP3334 is protected against damage from excessive power dissipation by its thermal overload protection circuit, which limits the die temperature to a maximum of 165°C. Under extreme conditions (i.e., high ambient temperature and power dissipation) where die temperature starts to rise above 165° ...
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... IN or OUT pins of the ADP3334 package. = 5.0 V and not recommended to use solder mask or silkscreen on the ) PCB traces adjacent to the ADP3334’s pins since it will increase = 900 mW (9) the junction-to-ambient thermal resistance of the package. ...
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... Keep the input capacitor as close as possible to the input and ground pins board traces with larger cross sectional areas will remove more heat from the ADP3334. For optimum heat transfer, specify thick copper and use wide traces. 4. Use additional copper layers or planes to reduce the thermal resistance ...
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... ADP3334 8-Lead Standard Small Outline Package [SOIC] Narrow Body (RN-8) Dimensions shown in millimeters and (inches) 5.00 (0.1968) 4.80 (0.1890 6.20 (0.2440) 4.00 (0.1574) 5.80 (0.2284) 3.80 (0.1497 1.27 (0.0500) 1.75 (0.0688) BSC 1.35 (0.0532) 0.25 (0.0098) 0.10 (0.0040) 0.51 (0.0201) COPLANARITY 0.25 (0.0098) 0.33 (0.0130) SEATING 0.10 0.19 (0.0075) PLANE COMPLIANT TO JEDEC STANDARDS MS-012AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS ...
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... Removed pin numbers from Figure Edits to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Edits to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Edits to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Added pinouts to PIN CONFIGURATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Added text to Calculating Junction Temperature section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Added LFCSP Layout Considerations section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Added Figure Updated 8-Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 REV. B –11– ADP3334 Page ...
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