ADP1879 Analog Devices, ADP1879 Datasheet - Page 5

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ADP1879

Manufacturer Part Number
ADP1879
Description
Synchronous Buck Controller with Constant On-Time and Valley Current Mode with Power Saving Mode
Manufacturer
Analog Devices
Datasheet
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VREG to PGND, GND
VIN, EN, PGOOD to PGND
FB, COMP, RES, SS to GND
DRVL to PGND
SW to PGND
BST to SW
BST to PGND
DRVH to SW
PGND to GND
PGOOD Input Current
θ
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Maximum Soldering Lead Temperature
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to PGND.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
JA
4-Layer Board
(10 sec)
(14-Lead LFCSP_WD)
Rating
−0.3 V to +6 V
−0.3 V to +28 V
−0.3 V to (VREG + 0.3 V)
−0.3 V to (VREG + 0.3 V)
−2.0 V to +28 V
−0.6 V to (VREG + 0.3 V)
−0.3 V to +28 V
−0.3 V to VREG
±0.3 V
35 mA
30°C/W
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
300°C
Rev. 0 | Page 5 of 40
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Boundary Condition
In determining the values given in Table 2 and Table 3, natural
convection is used to transfer heat to a 4-layer evaluation board.
Table 3. Thermal Resistance
Package Type
θ
ESD CAUTION
JA
JA
4-Layer Board
is specified for the worst-case conditions, that is, a device
(14-Lead LFCSP_WD)
ADP1878/ADP1879
θ
30
JA
Unit
°C/W

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