60874-2 TE Connectivity, 60874-2 Datasheet

60874-2

Manufacturer Part Number
60874-2
Description
Manufacturer
TE Connectivity
Datasheets

Specifications of 60874-2

Body Shape
B
Insulation Support
No
Hole Diameter (mm [in])
1.47 – 1.57 [0.058 – 0.062]
Disconnect Diameter (mm [in])
1.47 [0.058]
Stock Thickness (mm [in])
0.25 [0.010]
Contact Type
Pin
Plating Material
Gold (30)
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Not suitable for lead free processing
Pcb Thickness, Recommended (mm [in])
1.60 – 2.39 [0.063 – 0.094]
Packaging Method
Loose Piece
©2011 Tyco Electronics Corporation,
a TE Connectivity Ltd. Company
All Rights Reserved
TE logo is a trademark.
Product
Specification
.058 Diameter Printed Circuit Board Disconnect System
| Indicates Change
*Trademark
Other products, logos, and company names might be trademarks of their respective owners.
For latest revision, visit out website at www.te.com/documents
For Regional Customer service, visit our website at www.te.com
108-1025
11 Mar 11 Rev C
1 of 6
LOC B

Related parts for 60874-2

60874-2 Summary of contents

Page 1

... Product Specification .058 Diameter Printed Circuit Board Disconnect System ©2011 Tyco Electronics Corporation, | Indicates Change a TE Connectivity Ltd. Company *Trademark All Rights Reserved TE logo is a trademark. For latest revision, visit out website at www.te.com/documents For Regional Customer service, visit our website at www.te.com Other products, logos, and company names might be trademarks of their respective owners ...

Page 2

Rev C Figure 1 (cont) 108-1025 ...

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Rev C 108-1025 ...

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Rev C Figure 3 108-1025 ...

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Rev C 108-1025 ...

Page 6

Rev C 108-1025 ...

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