BAP50-02 NXP Semiconductors, BAP50-02 Datasheet - Page 3

General purpose PIN diode in a SOD523 small SMD plastic package

BAP50-02

Manufacturer Part Number
BAP50-02
Description
General purpose PIN diode in a SOD523 small SMD plastic package
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAP50-02
Manufacturer:
NXP
Quantity:
30 000
Part Number:
BAP50-02,115
Manufacturer:
SEIKO
Quantity:
2 300
NXP Semiconductors
ELECTRICAL CHARACTERISTICS
T
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
V
V
I
C
r
L
R
j
s
s
s
s
SYMBOL
R
SYMBOL
D
L
S
= 25 C unless otherwise specified.
F
R
21
21
21
21
General purpose PIN diode
d
th j-s
2
2
2
2
forward voltage
reverse voltage
reverse current
diode capacitance
diode forward resistance
isolation
insertion loss
insertion loss
insertion loss
charge carrier life time
series inductance
thermal resistance from junction to soldering point
PARAMETER
PARAMETER
Rev. 02 - 3 January 2008
I
I
V
V
V
V
I
I
I
V
V
V
I
I
I
I
I
I
I
I
I
when switched from I
I
measured at I
I
F
R
F
F
F
F
F
F
F
F
F
F
F
F
R
F
R
R
R
R
R
R
R
= 50 mA
= 0.5 mA; f = 100 MHz; note 1
= 1 mA; f = 100 MHz; note 1
= 10 mA; f = 100 MHz; note 1
= 0.5 mA; f = 900 MHz
= 0.5 mA; f = 1800 MHz
= 0.5 mA; f = 2450 MHz
= 1 mA; f = 900 MHz
= 1 mA; f = 1800 MHz
= 1 mA; f = 2450 MHz
= 10 mA; f = 900 MHz
= 10 mA; f = 1800 MHz
= 10 mA; f = 2450 MHz
= 100 mA; f = 100 MHz
= 10 A
= 6 mA; R
= 50 V
= 0; f = 1 MHz
= 1 V; f = 1 MHz
= 5 V; f = 1 MHz
= 0; f = 900 MHz
= 0; f = 1800 MHz
= 0; f = 2450 MHz
CONDITIONS
L
R
= 100 ;
= 3 mA
F
= 10 mA to
50
MIN.
0.95
0.4
0.3
0.22
25
14
3
20.4
17.3
15.5
1.74
1.79
1.88
1.03
1.09
1.15
0.26
0.32
0.34
1.05
0.6
TYP.
VALUE
Product specification
85
BAP50-02
1.1
100
0.55
0.35
40
25
5
MAX.
3 of 7
UNIT
K/W
V
V
nA
pF
pF
pF
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
nH
UNIT
s

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