BAP70-05 NXP Semiconductors, BAP70-05 Datasheet - Page 2

Two planar PIN diodes in common cathode configuration in a SOT23 small SMD plastic package

BAP70-05

Manufacturer Part Number
BAP70-05
Description
Two planar PIN diodes in common cathode configuration in a SOT23 small SMD plastic package
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
5. Limiting values
6. Thermal characteristics
7. Characteristics
Table 6.
T
BAP70-05_3
Product data sheet
Symbol
V
I
C
r
L
R
D
amb
L
S
F
d
= 25 C unless otherwise specified.
Characteristics
Parameter
forward voltage
reverse current
diode capacitance
diode forward resistance
charge carrier life time
series inductance
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Table 5.
Symbol
V
I
P
T
T
Symbol
R
F
stg
j
R
tot
th(j-sp)
Limiting values
Thermal characteristics
Parameter
thermal resistance from junction
to solder point
Parameter
reverse voltage
forward current
total power dissipation
storage temperature
junction temperature
Conditions
I
V
see
see
when switched from I
I
I
I
F
R
R
F
R
= 50 mA
V
V
V
I
I
I
I
= 100 mA; f = 100 MHz
= 6 mA; R
= 3 mA
F
F
F
F
= 50 V
R
R
R
Figure
Figure
= 0.5 mA
= 1 mA
= 10 mA
= 100 mA
= 0 V
= 1 V
= 20 V
Rev. 03 — 5 April 2007
1; f = 1 MHz;
2; f = 100 MHz;
L
= 100 ; measured at
F
= 10 mA to
Conditions
continuous voltage
continuous current
T
sp
= 90 C
Conditions
Min
-
-
-
-
-
-
-
-
-
-
-
Min
-
-
-
65
65
Typ
0.95
-
600
430
250
77
40
5.4
1.4
1.25
1.4
BAP70-05
Max
50
100
250
+150
+150
Typ
220
© NXP B.V. 2007. All rights reserved.
Silicon PIN diode
Max
1.1
100
-
-
300
100
50
7
1.9
-
-
Unit
V
mA
mW
Unit
K/W
C
C
Unit
V
nA
fF
fF
fF
nH
s
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