787535-1 TE Connectivity, 787535-1 Datasheet - Page 2

787535-1

Manufacturer Part Number
787535-1
Description
Manufacturer
TE Connectivity
Datasheets

Specifications of 787535-1

Product Type
Connector
Profile
High
Pcb Mount Style
Through Hole
Pcb Mount Retention
With
Pcb Mounting Orientation
Right Angle
Type Of Connector
Blindmate
Pcb Mount Alignment
Without
Retention Leg Material
Brass
Color
Black
Sealed Bottom
Without
Product Series
Series I
Retention Leg Plating
Tin-lead over Nickel
Termination Post Length (mm [in])
2.54 [0.100]
Solder Tail Contact Plating
Tin-Lead over Nickel
Number Of Positions
80
Centerline (mm [in])
1.27 [0.050]
Pcb Mount Retention Type
Boardlock(s)
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Phosphor Bronze
Connector Style
Receptacle
Housing Temperature Rating
High
Housing Material
Liquid Crystal Polymer (LCP)
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Wave solder capable to 240°C
Applies To
Printed Circuit Board
Application
SCA2 (Single Connector Attachment), SCSI

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
787535-1
Manufacturer:
AMP
Quantity:
40 604
Part Number:
787535-1
Manufacturer:
Kyocera
Quantity:
750
3.3.
3.4.
3.5.
Examination of product.
Termination resistance.
Insulation resistance.
Dielectric withstanding voltage.
Temperature rise vs current.
Solderability.
Rev A
Ratings
!
!
!
Performance and Test Description
Product is designed to meet electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per Test Specification 109-1.
Test Requirements and Procedures Summary
Test Description
Voltage: 100 volts AC
Current: The maximum current at 30° C temperature r ise shall not exceed values listed for specific
contact positions energized as shown in Figure 1, reference EIA 700A0AE and Figures 5A and 5B.
Temperature: -55 to 105° C
NOTE
Position
Current levels are based on steady state conditions. When the connector is used in “hot
plug” applications, current spikes shall be minimized using a current limiting device.
Size
80
Current
(A)
2
3
Meets requirements of product
drawing and Application
Specification 114-6061.
∆R 15 milliohms maximum.
1000 megohms minimum.
300 vac at sea level.
See Para 3.3.B.
Solderable area shall have
minimum of 95% solder coverage.
Voltage
(V)
12
5
Figure 2 (continued)
MECHANICAL
ELECTRICAL
Requirement
Figure 1
Contact Positions
Voltage Applied
(In Parallel)
34, 35
2, 3, 4
Contact Positions
Visual, dimensional and functional
per applicable quality inspection
plan.
TE Spec 109-6-1.
Subject mated contacts assembled
in housing to 50 mv maximum open
circuit at 100 ma maximum.
See Figure 4.
TE Spec 109-28-4.
Test between adjacent contacts of
mated samples.
TE Spec 109-29-1.
Test between adjacent contacts of
mated samples.
TE Spec 109-45-1.
Changes made for compliance with
EIA 700A0AE.
See Figure 5.
TE Spec 109-11-2.
Subject samples to solderability.
(In Parallel)
41, 42, 43
Ground
75, 76
Procedure
108-1548
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