MCP6541-E/P Microchip Technology, MCP6541-E/P Datasheet - Page 24
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MCP6541-E/P
Manufacturer Part Number
MCP6541-E/P
Description
IC COMP 1.6V SNGL P-P 8DIP
Manufacturer
Microchip Technology
Type
General Purposer
Specifications of MCP6541-E/P
Output Type
CMOS, Push-Pull, Rail-to-Rail, TTL
Package / Case
8-DIP (0.300", 7.62mm)
Number Of Elements
1
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Through Hole
Number Of Channels
1 Channel
Product
Analog Comparators
Offset Voltage (max)
7 mV
Input Bias Current (max)
0.000001 uA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MCP6541/1R/1U/2/3/4
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21696F-page 24
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
A2
A1
E1
L1
N
A
E
D
e
h
L
c
b
1.25
0.10
0.25
0.40
0.17
0.31
MIN
0°
5°
5°
h
L
L1
–
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-057B
© 2007 Microchip Technology Inc.
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
c