3-292292-1 TE Connectivity, 3-292292-1 Datasheet
3-292292-1
Specifications of 3-292292-1
Related parts for 3-292292-1
3-292292-1 Summary of contents
Page 1
... AMP Specifications: A 109-5000 Test Specification, General Requirements for Test Methods B 501-60001 Qualification Test Report 2.2 Other Documents: A IEC 60512 Connectors used for frequencies below 3MHz B IEC 60068 Basic environmental testing procedures for electric component and electronic equipment C ISO7816-2 Identification Cards – Integrated ...
Page 2
... Subject mated contacts assembled in housing Max open circuit at 100 mA DC. See also para. 3.6.1 In acc. with IEC 60512-2 test 2a Impressed voltage 100 V DC. Unmated card. In acc. with IEC 60512-2 test 3a 500VAC for 1 minute. Unmated card. In acc. with IEC 60512-2 test 4a REV LOC 108-60031 B ...
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... Electrical load; 0.8A Use Au-plated dummy card. Card thickness; 0.76mm In acc. With IEC 60512-5 Test 9b Under loaded specified current or rating current. In acc. With IEC 60512-3 Test 5b Normal force test equipment (Force/ Deflection curve) Vibration Frequency: 10-50Hz / 0.8mm, 60-500Hz / 6G Vibration Direction: 3directions. Duration: 2 hours each In acc ...
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... Recovery time 2 hours. Use Au-plated dummy card. Card thickness; 0.76mm In acc, with IEC 60068-2-14 70°C, Duration: 16 hrs. Recovery time; 2 hours Sample 1 and 2 unmated Sample 3 and 4 mated: Use Au-plated dummy card. Card thickness; 0.76mm In acc. with IEC 60512-6 Test 11i REV LOC 108-60031 B ...
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... Temperature; -25 ‘ Duration: 2 hrs. Recovery time; 2 hours Use Au-plated dummy card. Card thickness; 0.76mm In acc. with IEC 60512-5 Test 11j Solder Temperature : 215 r 3 °C Immersion Duration : 3 r 0.3 seconds Ageing : 16 hrs at 155 ‘ In acc. with IEC 60068-2-20 test Ta 2 cycles of heat curve covering IR soldering curve specified figure 4 ...
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... Additional Testing Details 3.6.1 Terminal Resistance 3.6.2 The actual Phone Hand-sets shall be used for Mechanical Operation, Vibration and Physical Shock tests or else test frame(s) shall simulate the actual application as indicated in figures 3 (slide insertion). Ref. Mating-force Tyco Electronics AMP Shanghai Ltd. ASHL-0005- ES REV A Figure 2. ...
Page 7
... IR Reflow Profile Resistance to soldering heat test samples shall be placed on a bare surface of a Printed Circuit Board. Test heat-curve shall cover the IR/Convection solder reflow conditions as Indicated In figure 4. All temperatures refer to the topside of the package as measured on the PC-board surface. Between exposures, parts shall be allowed to cool down to room temperature, for 5 minutes minimum. 130± ...
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... Termination Resistance Insulation Resistance Voltage Proof Electrical load & temperature Current carrying capacity Contact normal force Vibration (Sinusoidal) Mechanical Operation 1 Mechanical Operation 2 Mechanical Operation 3 Physical Shock 1 Physical Shock 2 Rapid change of temperature Dry Heat 1 Dry Heat 2 Damp / heat steady state Cold Solder ability ...
Page 9
... PLA SIM Reader Slide Type With Pegs 292296-1 ASSY 6P H=2.85 mm Max. PLA SIM Reader Slide Type With Pegs PLA SIM Reader Slide Type With Pegs ASSY 6P Space Saving Type Appendix. 1 PAGE NO 9 Description ASSY 6P H=2.7 mm. ASSY 6P (STD) 108-60031 REV LOC B ES ...