BAT30F3 STMicroelectronics, BAT30F3 Datasheet - Page 8

• Manufacturer Part Number: BAT30F3
• Description: Schottky Barrier, Signal Schottky
• Manufacturer: STMicroelectronics

PCB recommendations
4.2
8/10
Assembly
For chip scale package mounting on the PCB, STMicroelectronics recommends the use of a
solder stencil aperture of 330 x 330 µm maximum and a typical stencil thickness of 75 or
80 µm. Chip scale packages are fully compatible with the use of near eutectic 95.5 Sn, 4 Ag,
0.5 Cu solder paste with no-clean flux. ST's recommendations for chip scale package board
mounting are illustrated on the soldering reflow profile shown in
Figure 11. ST ECOPACK
Dwell time in the soldering zone (with temperature higher than 220 °C) has to be kept as
short as possible to prevent component and substrate damage. Peak temperature must not
exceed 260 °C. Controlled atmosphere (N2 or N2H2) is recommended during the whole
reflow, especially above 150 °C.
Chip scale packages are able to withstand three times the previous recommended reflow
profile in order to be compatible with a double reflow when SMDs are mounted on both sides
of the PCB and one additional repair.
A maximum of three soldering reflows are allowed for these lead-free packages (with repair
step included).
The use of a no-clean flux is highly recommended to avoid any cleaning operation. To
prevent any bump cracks, ultrasonic cleaning methods are not recommended.
Temperature (°C)
Temperature (°C)
260°C max
260°C max
255°C
255°C
125 °C
125 °C
220°C
220°C
180°C
180°C
0
0
0
0
3°C/s max
3°C/s max
1
1
®
recommended soldering reflow profile for PCB mounting
Doc ID 16915 Rev 2
90 to 150 sec
90 to 150 sec
2
2
3
3
4
4
90 sec max
90 sec max
10-30 sec
10-30 sec
5
5
Figure
2°C/s recommended
6
6
6°C/s max
2°C/s recommended
11.
6°C/s max
Time (min)
Time (min)
7
7
BAT30F3