STM32L152V8 STMicroelectronics, STM32L152V8 Datasheet - Page 97

• Manufacturer Part Number: STM32L152V8
• Description: Ultra-low-power Cortex-M3 MCU with 64 Kbytes Flash, RTC, LCD, USB, ADC
• Manufacturer: STMicroelectronics

Specifications of STM32L152V8

• Operating Power Supply Range: 1.65 V to 3.6 V (without BOR) or 1.8 V to 3.6 V (with BOR option)
• Temperature Range: –40 to 85 °C
• 4 Modes: Sleep, Low-power run (9 μA at 32 kHz), Low-power sleep (4.4 μA),Stop with RTC (1.45 μA), Stop (570 nA), Standby (300 nA)
• Ultralow Leakage Per I/o: 50 nA
• Fast Wakeup From Stop: 8 μs
• Core: ARM 32-bit Cortex™-M3 CPU
• Dma: 7-channel DMA controller, supporting timers, ADC, SPIs, I2Cs and USARTs

STM32L151xx, STM32L152xx
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this
Figure 31. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package
back-side pad to PCB ground.
Table 58.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
D
E
L
T
b
e
outline
Symbol
(1)(2)(3)
UFQFPN48 – ultra thin fine pitch quad flat pack no-lead 7 × 7 mm, 0.5 mm
pitch package mechanical data
0.500
0.000
6.900
6.900
0.300
0.200
Typ
millimeters
0.550
7.000
7.000
0.400
0.152
0.250
0.500
0.020
Doc ID 17659 Rev 6
Min
0.600
0.050
7.100
7.100
0.500
0.300
Max
Figure 32. Recommended footprint
7.30
0.30
0.55
0.0197
0.0000
0.2717
0.2717
0.0118
0.0079
0.20
Typ
12
1
48
13
(dimensions in mm)
6.20
Package characteristics
inches
0.0217
0.2756
0.2756
0.0157
0.0060
0.0098
0.0197
7.30
5.60
5.80
0.0008
6.20
Min
(1)
5.60
0.50
37
24
36
25
0.0236
0.0020
0.2795
0.2795
0.0197
0.0118
0.75
Max
(1)
5.80
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