STM32L152VD STMicroelectronics, STM32L152VD Datasheet - Page 117
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STM32L152VD
Manufacturer Part Number
STM32L152VD
Description
Ultra-low-power Cortex-M3 MCU with 384 Kbytes Flash, RTC, LCD, USB, ADC
Manufacturer
STMicroelectronics
Datasheet
1.STM32L151QD.pdf
(121 pages)
Specifications of STM32L152VD
Operating Power Supply Range
1.65 V to 3.6 V (without BOR) or 1.8 V to 3.6 V
7 Modes
Sleep, Low-power run (11 μA at 32 kHz) , Low-power sleep (4.4 μA), Stop with RTC, Stop (650 nA), Standby with RTC, Standby (300 nA)
Ultralow Leakage Per I/o
50 nA max
Fast Wakeup Time From Stop
8 μs
Core
ARM 32-bit Cortex™-M3 CPU
Dma
12-channel DMA controller
11 Timers
one 32-bit and six 16-bit general-purpose timers, two 16-bit basic timers, two watchdog timers (independent and window)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32L152VDT6
Manufacturer:
HONEYWELL
Quantity:
1 200
Company:
Part Number:
STM32L152VDT6
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM32L151xD, STM32L152xD
Figure 42. UFBGA132, 7 x 7 mm, 132-ball ultra thin, fine-pitch ball grid array package
1. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
2. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
Table 71.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Symbol
A1
A2
A
b
outline
UFBGA132 package mechanical data
Side view
0.46
0.05
0.40
0.17
Min
rotated 90°
Detail A
2
millimeters
Doc ID 022027 Rev 2
Pad Corner
0.53
0.08
0.45
0.28
Typ
Seating plane
Detail A
A1 Ball
1
Max
0.60
0.11
0.50
0.33
Top view
0.0181
0.0020
0.0157
0.0067
Min
Bottom view
Package characteristics
inches
0.0209
0.0032
0.0177
0.0110
Typ
A1 Ball Pad Corner
(1)
0.0236
0.0043
0.0197
0.0130
Max
117/121