STM8TL53G4 STMicroelectronics, STM8TL53G4 Datasheet - Page 57

• Manufacturer Part Number: STM8TL53G4
• Description: 8-bit, ultra-low-power, touch-sensing MCUs with 16-Kbyte Flash and proximity detection
• Manufacturer: STMicroelectronics

Specifications of STM8TL53G4

• Operating Power Supply: 1.65 V to 3.6 V
• Temperature Range: –40 °C to 85 °C
• 4 Low Power Modes: Wait, Active-halt with AWU (1 μA), Active-halt with ProxSense™ (10 μA with scan every 200 ms),Halt (0.4 μA)
• Dynamic Power Consumption: 150 μA/MHz
• Fast Wakeup From Halt Mode: 4.7 μs
• Ultralow Leakage Per I/o: 50 nA

STM8TL53xx
Figure 19. UFQFPN28 - 28-lead ultra thin fine pitch quad flat no-lead package outline (4x4)
1. Drawing is not to scale.
2. Dimensions are in millimeters.
3. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
4. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this
Table 39.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
back-side pad to PCB ground.
Dim.
ddd
A1
A3
L1
L2
A
D
E
N
b
e
and UFQFPN28 recommended footprint
UFQFPN28 - 28-lead ultra thin fine pitch quad flat no-lead package (4x4),
package mechanical data
Min.
0.18
0.25
0.5
0.3
0
-
-
-
-
-
0.152
Typ.
0.55
0.02
0.25
0.35
0.08
mm
0.5
0.4
4
4
Doc ID 022344 Rev 1
Max.
0.05
0.45
0.6
0.3
0.5
-
-
-
-
-
Number of pins
28
0.0197
0.0071
0.0098
0.0118
Min.
0
-
-
-
-
-
inches
Package characteristics
0.0217
0.0008
0.0060
0.0098
0.1575
0.1575
0.0197
0.0138
0.0157
0.0031
Typ.
(1)
0.0236
0.0118
0.0177
0.0197
0.002
Max.
-
-
-
-
-
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