STM8L151F3 STMicroelectronics, STM8L151F3 Datasheet - Page 103

• Manufacturer Part Number: STM8L151F3
• Description: STM8L-Ultra Low Power-8 bits Microcontrollers
• Manufacturer: STMicroelectronics

Specifications of STM8L151F3

• Operating Power Supply: 1.65 to 3.6 V (without BOR), 1.8 to 3.6 V (with BOR)
• Temperature Range: -40 to 85 or 125 °C
• 5 Low Power Modes: Wait, Low power run, Low power wait, Active-halt with RTC, Halt
• Ultralow Leakage Per I/0: 50 nA
• Fast Wakeup From Halt: 5 μs
• Max Freq: 16 MHz, 16 CISC MIPS peak

1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-
4. Dimensions are in millimeters.
STM8L151x2, STM8L151x3
Table 59.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 43. UFQFPN32 - 32-lead ultra thin fine pitch
side pad to PCB ground.
Dim.
ddd
D2
A1
A3
E2
A
D
E
N
b
e
L
Seating plane
Pin # 1 ID
R = 0.30
C
E2
A3
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5),
quad flat no-lead package outline
(5 x 5)
package mechanical data
b
8
1
32
9
0.00
0.18
4.90
4.90
3.40
0.30
Min
0.5
(1)(2)(3)
e
Bottom view
D2
D
16
0.152
0.500
L
0.55
0.02
0.23
5.00
3.50
5.00
3.50
0.40
0.08
mm
Typ
17
24
L
A1
E
A
Doc ID 018780 Rev 3
ddd C
A0B8_ME
Max
0.05
0.28
5.10
5.10
3.60
0.50
0.6
Number of pins
32
Figure 44. UFQFPN32 recommended
0.0197
0.0071
0.1929
0.1929
0.1339
0.0118
Min
0
footprint
inches
0.0217
0.0008
0.0091
0.1969
0.1378
0.1969
0.1378
0.0197
0.0157
0.0031
Package characteristics
0.006
Typ
(1)(4)
(1)
0.0110
0.0236
0.0020
0.2008
0.2008
0.1417
0.0197
Max
103/111