LM2901DG ON Semiconductor, LM2901DG Datasheet - Page 11
![IC COMP QUAD SGL SUPPLY 14SOIC](/photos/6/57/65767/14-soic_751a_sml.jpg)
LM2901DG
Manufacturer Part Number
LM2901DG
Description
IC COMP QUAD SGL SUPPLY 14SOIC
Manufacturer
ON Semiconductor
Type
General Purposer
Datasheet
1.LM239NG.pdf
(12 pages)
Specifications of LM2901DG
Number Of Elements
4
Output Type
CMOS, Open-Collector, TTL
Voltage - Supply
3 V ~ 36 V, ±1.5 V ~ 18 V
Mounting Type
Surface Mount
Package / Case
14-SOIC (0.154", 3.90mm Width)
Package
14SOIC
Typical Response Time
1.3 us
Typical Response Time Range
0.5 to 5 us
Typical Voltage Gain Range
90 to 110 dB
Number Of Channels Per Chip
4
Minimum Single Supply Voltage
3 V
Power Supply Type
Single|Dual
Number Of Channels
4 Channels
Response Time
1.3 us
Offset Voltage (max)
7 mV
Input Bias Current (max)
250 nA
Supply Voltage (max)
36 V
Supply Voltage (min)
3 V
Supply Current (max)
2 mA
Maximum Power Dissipation
1000 mW
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Comparator Type
General Purpose
No. Of Comparators
4
Ic Output Type
CMOS, TTL
Supply Current
1mA
Supply Voltage Range
3V To 36V
Amplifier Case Style
SOIC
Rohs Compliant
Yes
Number Of Elements
4
Technology
Bipolar
Input Offset Voltage
7mV
Input Bias Current (typ)
250nA
Single Supply Voltage (typ)
5/9/12/15/18/24/28V
Dual Supply Voltage (typ)
±3/±5/±9/±12/±15V
Power Supply Requirement
Single/Dual
Voltage Gain In Db
100dB
Single Supply Voltage (min)
3V
Single Supply Voltage (max)
36V
Dual Supply Voltage (min)
±1.5V
Dual Supply Voltage (max)
±18V
Power Dissipation
1W
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
14
Package Type
SOIC
Output Compatibility
CMOS, TTL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
LM2901DG
LM2901DGOS
LM2901DGOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LM2901DG
Manufacturer:
ON
Quantity:
3 500
Part Number:
LM2901DG
Manufacturer:
ON/安森美
Quantity:
20 000
−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
0.10 (0.004)
REF
8
7
M
−U−
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
1
B
T
H
1.26
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
11
SECTION N−N
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE DAMBAR
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
0.65
PITCH
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10 0.193
4.50 0.169
1.20
0.15 0.002
0.75 0.020
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
8
_
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_