DS1842A Maxim, DS1842A Datasheet - Page 2

• Manufacturer Part Number: DS1842A
• Description: The DS1842A integrates the discrete high-voltage components necessary for avalanche photodiode (APD) bias and monitor applications
• Manufacturer: Maxim

76V, APD, Dual Output Current Monitor
ABSOLUTE MAXIMUM RATINGS
Voltage Range on CLAMP
Voltage Range on MIRIN, MIROUT, FBIN
Voltage Range on FBOUT Relative to GND ..........-0.3V to +6.0V
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
ELECTRICAL CHARACTERISTICS
(T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
Note 2: Rising MIROUT transition from 10µA to 1mA; V
Note 3: Not production tested. Guaranteed by design.
2
CLAMP Voltage
CLAMP Threshold
Maximum MIROUT Current
MIR1 to MIROUT Ratio
MIR2 to MIROUT Ratio
MIR1, MIR2 Rise Time
(20%/80%)
Shutdown Temperature
Hysteresis Temperature
Leakage on CLAMP
Resistor-Divider Ratio (R
Resistor-Divider Tempco
Resistor-Divider End-to-End
Resistance
Relative to GND...................................................-0.3V to +12V
MIR1, and MIR2 Relative to GND........................-0.3V to +80V
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
A
= -40°C to +85°C, unless otherwise noted.)
_______________________________________________________________________________________
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
1
/R
2
)
SYMBOL
I
V
MIROUT
T
K
K
R
CLAMP
T
V
SHDN
t
MIR1
MIR2
HYS
K
I
RES
RC
CLT
JC
IL
R
) ...................8°C/W
JA
) ............41°C/W
CLAMP = low
CLAMP = high
15V < V
15V < V
(Note 2)
(Note 3)
(Note 3)
T
T
A
A
= +25°C, V
= +25°C, V
MIRIN
MIRIN
MIRIN
= 40V, 2.5kΩ load.
< 76V, I
< 76V, I
FBIN
FBIN
CONDITIONS
= 76V
= 76V
Continuous Power Dissipation (TA = +70°C)
Operating Junction Temperature Range ...........-40°C to +150°C
Storage Temperature Range .............................-55°C to +135°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
TDFN (derate 24.4mW/°C above +70°C).................1951.2mW
MIROUT
MIROUT
> 1μA
> 1μA
0.096
0.192
1.25
59.5
MIN
308
1.8
-1
0
0.100
0.200
+150
TYP
2.75
±50
385
1.8
30
5
0.104
0.208
60.25
MAX
2.35
3.85
481
+1
11
10
ppm/°C
UNITS
A/A
A/A
mA
μA
μA
k
ns
°C
°C
V
V