MAX4002 Maxim, MAX4002 Datasheet - Page 16

• Manufacturer Part Number: MAX4002
• Description: The MAX4000/MAX4001/MAX4002 low-cost, low-power logarithmic amplifiers are designed to control RF power amplifiers (PA) operating in the 0
• Manufacturer: Maxim

The MAX4000/MAX4001/MAX4002 family of log amps
respond to voltage, not power, even though input levels
are specified in dBm. It is important to realize that input
signals with identical RMS power but unique waveforms
results in different log amp outputs.
Differing signal waveforms result in either an upward or
downward shift in the logarithmic intercept. However,
the logarithmic slope remains the same.
As with any RF circuit, the layout of the MAX4000/
MAX4001/MAX4002 circuits affects performance. Use a
short 50Ω line at the input with multiple ground vias
along the length of the line. The input capacitor and
resistor should both be placed as close to the IC as
possible. V
ble to the IC with multiple vias connecting the capacitor
to the ground plane. It is recommended that good RF
components be chosen for the desired operating fre-
quency range. Electrically isolate RF input from
other pins (especially SET) to maximize perfor-
mance at high frequencies (especially at the high
power levels of the MAX4002).
2.5GHz 45dB RF-Detecting Controllers
16
______________________________________________________________________________________
TOP VIEW
TOP VIEW
(BUMPS ON BOTTOM)
CC
should be bypassed as close as possi-
C
A
B
SHDN
CLPF
RFIN
SET
Waveform Considerations
RFIN
V
V
1
CC
CC
3
4
1
2
Pin Configurations
Layout Considerations
MAX4000
MAX4001
MAX4002
MAX4000
MAX4001
MAX4002
UCSP
μMAX
SHDN
OUT
2
CLPF
GND
8
7
6
5
SET
3
V
OUT
N.C.
GND
CC
The UCSP represents a unique package that greatly
reduces board space compared to other packages.
UCSP reliability is integrally linked to the user’s assem-
bly methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP. This form factor may not
perform equally to a packaged product through tradi-
tional mechanical reliability tests. Performance through
operating life test and moisture resistance remains
uncompromised as it is primarily determined by the
wafer fabrication process. Mechanical stress perform-
ance is a greater consideration for a UCSP. UCSP sol-
der joint contact integrity must be considered since the
package is attached through direct solder contact to
the user’s PCB. Testing done to characterize the UCSP
reliability performance shows that it is capable of per-
forming reliably through environmental stresses.
Results of environmental stress tests and additional
usage data and recommendations are detailed in the
UCSP application note, which can be found on Maxim’s
website, www.maxim-ic.com.
TRANSISTOR COUNT: 358
PROCESS: Bipolar
Chip Information
UCSP Reliability