MAX4996 Maxim, MAX4996 Datasheet - Page 2

• Manufacturer Part Number: MAX4996
• Description: The MAX4996/MAX4996L triple DPDT analog switches operate from a single +2
• Manufacturer: Maxim

Triple DPDT, Low-Capacitance Data Switches
ABSOLUTE MAXIMUM RATINGS
V
EN, EN, CB_ ..........................................................-0.3V to +6.0V
All Other Pins to GND ..................................-0.3V to V
Continuous Current
Peak Current NO_, NC_, COM_
ESD per Human Body Model...............................................±2kV
ELECTRICAL CHARACTERISTICS
(V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
ANALOG SWITCH
Analog Signal Range
On-Resistance
On-Resistance Match Between
Channels
On-Resistance Flatness
Off-Leakage Current
On-Leakage Current
-3dB Bandwidth
Off-Isolation
C r osstal k
LOGIC INPUTS
Input Logic High
Input Logic Low
Input Leakage Current
CC
CC
NO_, NC_, COM_ .......................................................±150mA
(pulsed at 1ms, 50% Duty Cycle)...............................±300mA
(pulsed at 1ms, 10% Duty Cycle)...............................±450mA
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +6.0V
= +2.5V to +5.5V, T
layer board. For detailed information on package thermal considerations see www.maxim-ic.com/thermal-tutorial.
PARAMETER
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
V
I
SYMBOL
COM
NO
V
I
R
ΔR
I
COM
(OFF)
V
R
LEAK
COM
V
BW
V
FLAT
V
, V
ISO
ON
CT
_
IH
IL
ON
(ON)
NC
_
,
_
V
V
V
V
V
V
V
V
V
V
V
R
f = 1MHz, V
C
Figure 4 (Note 6)
f = 1MHz, V
R
0 ≤ V ≤ V
V
C OM
N O
N O
N O
CC
NO
CC
COM
CC
CC
CC
L
L
CC
L
= R
= R
= 5pF, R
CC
_ , V
, V
_, V
_ = 1.5V or V
= 4V , V
= 5.5V , V
= 5.5V , V
= 2.8V, I
= 2.5V, I
= 5.5V
_= 0 to V
_= 0 to V
N C
S
S
+ 0.3V
N C
N C
= 50Ω, C
= 50Ω, Figure 4 ( N ote 7)
IL
w i th 50µA sink cur r ent to GN D
_unconnected
_ = 4V , 0
and V
C OM
NO
NO
L
COM
COM
C OM
C OM
C C
= R
CC
_, V
_, V
CONDITIONS
_ = 0, 4V ;
, I
IH
NC _
S
_ = 5.5V ;
_ = 0, 5.5V ;
_= 25mA;
_= 25mA;
L
(Note 5)
C OM
NC
NC
= 50Ω,
= 5pF, Figure 4
≤ V ≤ V
Continuous Power Dissipation (T
Thermal Resistance (Note 1)
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering) .........................................+300°C
_ = 0;
_ = 0;
= 1.5V (Note 4)
24-Pin TQFN (derate 20.8mW/°C
above +70°C).............................................................1228mW
θ
θ
_= 25m A
JA
JC
.............................................................................65.1°C/W
...............................................................................5.4°C/W
CC
;
CC
= 2.8V, T
MIN
-250
-250
-250
1.4
0
A
= +70°C)
A
-120
= +25°C.) (Notes 2, 3)
TYP
670
-60
0.1
0.2
2
+250
+250
+250
MAX
V
180
0.2
0.5
0.5
CC
4
UNITS
MHz
nA
µA
nA
dB
dB
nA
Ω
Ω
Ω
V
V
V