IR3502MPBF International Rectifier, IR3502MPBF Datasheet - Page 37
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IR3502MPBF
Manufacturer Part Number
IR3502MPBF
Description
Complete VR11.0 or VR11.1 power solution.
Manufacturer
International Rectifier
Datasheet
1.IR3502MPBF.pdf
(39 pages)
Specifications of IR3502MPBF
Package
32-Lead MLPQ
Circuit
X-Phase Control IC
Switch Freq (khz)
250kHz to 1.5MHz
Pbf
PbF Option Available
Solder Resist
• The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
• The minimum solder resist width is 0.13mm.
• At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
• The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
• Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
• The four vias in the land pad should be tented or plugged from bottom board side with solder resist.
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non
Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
fillet so a solder resist width of ≥ 0.17mm remains.
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable
to have the solder resist opening for the land pad to be smaller than the part pad.
aspect ratio of the solder resist strip separating the lead lands from the pad land.
Page 37 of 39
July 28, 2009
IR3502