SLE 66R35E7 Infineon Technologies, SLE 66R35E7 Datasheet - Page 5

• Manufacturer Part Number: SLE 66R35E7
• Manufacturer: Infineon Technologies

Specifications of SLE 66R35E7

• Interface: ISO / IEC 14443 Type A
• Eeprom: 1,024.0 Byte
• Security Features: 7-byte UID, mutual three pass authentication with 48-bit keys
• Delivery Forms: Wafer, NiAu-bump, MCC2, MCC8MCC2-2-1 = SP000981148MCC8-2-6 = SP000981152
• Typical Application: Transport, Access Control

1
Table 1-1
1) Available as a Module Contactless Card (MCC) for embedding in plastic cards, as NiAu-bumped version (NB) or as a die
For more ordering information (wafer thickness or height of NiAu-bump) please contact your local Infineon sales
office.
Figure 1-1 Pin Configuration Module Contactless Card - MCC2-2-1 (top view)
Figure 1-2 Pin Configuration Module Contactless Card - MCC8-2-6 (top / bottom view)
Figure 1-3 Pad Configuration Die
Table 1-2
Preliminary Short Product Information
Type
SLE 66R35E7 C
SLE 66R35E7 NB
SLE 66R35E7 MCC2
SLE 66R35E7 MCC8
Symbol
L
L
A
B
on sawn / unsawn wafer for customer packaging.
Ordering and Packaging Information
Pin description and function
Ordering information
Function
Antenna Connection
Antenna Connection
Package
Die (on wafer)
Die (on wafer)
MCC2-2-1
MCC8-2-6
1)
L
A
SLE 66R35E7
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Remark
sawn / unsawn
NiAu-bumps, sawn
L
B
Ordering and Packaging Information
Ordering code
on request
on request
SP000981148
SP000981152
SLE 66R35E7
2012-02-29