BAT54-05W Infineon Technologies, BAT54-05W Datasheet
BAT54-05W
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BAT54-05W Summary of contents
Page 1
... Package Configuration SOT23 single TSLP-2-7 single SC79 single SOD323 single SOT23 series SOT323 series SOT23 common cathode SOT323 common cathode SOT23 common anode SOT323 common anode SOT323 single 1 BAT54... BAT54-05 BAT54-06 BAT54-05W BAT54-06W L Marking (nH) S 1.8 T 0.4 54 0.6 b 1.8 blue 5 1.8 TS 1.4 TS 1.8 TC 1.4 TC 1.8 TA 1.4 TA 1.4 T5 ...
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... BAT54-03W ≤ 71 °C BAT54-04 ≤ 117 °C BAT54-04W ≤ 48 °C BAT54-05 ≤ 110 °C BAT54-05W ≤ 71 °C BAT54-06 ≤ 117 °C BAT54-06W ≤ 125 °C BAT54W Junction temperature Storage temperature 1 Device mounted on epoxy PCB 1 cm² ...
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... Thermal Resistance Parameter 1) Junction - soldering point BAT54 BAT54-02LRH BAT54-02V BAT54-03W BAT54-04 BAT54-04W BAT54-05 BAT54-05W BAT54-06 BAT54-06W BAT54W Electrical Characteristics at T Parameter DC Characteristics 2) Breakdown voltage µA (BR) 2) Reverse current Forward voltage 100 mA ...
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... Electrical Characteristics at T Parameter AC Characteristics Diode capacitance MHz R Reverse recovery time mA mA, measured 100 Ω 25°C, unless otherwise specified A Symbol BAT54... Values Unit min. typ. max 2011-06-29 ...
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... Reverse current Parameter R 10 µ Forward Voltage Parameter F 0.5 V 0.3 0 ƒ IR(25V) IR(5V °C = ƒ 30mA 10mA 1mA 0.1mA - 2011-06-29 BAT54... 125 T A °C 125 T A ...
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... V 1 Forward current I BAT54-02V 220 mA 180 160 140 120 100 105 120 °C 150 ƒ 105 120 °C = ƒ 105 120 °C 2011-06-29 BAT54... 150 T S 150 T S ...
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... Forward current I BAT54-04W 220 mA 180 160 140 120 100 105 120 °C 150 Forward current I BAT54-05W 220 mA 180 160 140 120 100 105 120 °C 150 ƒ 105 120 ° ...
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... Forward current I BAT54-06W 220 mA 180 160 140 120 100 105 120 °C 150 105 120 °C 150 ƒ 105 120 °C 2011-06-29 BAT54... 150 T S ...
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... Package SC79 9 BAT54... 2011-06-29 ...
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... BAT54... ...
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... Package SOD323 11 BAT54... 2011-06-29 ...
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... Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT23 2.9 ±0 +0.1 0.4 -0.05 C 0.95 1.9 0. Lead width can be 0.6 max. in dambar area 0.8 0.8 1.2 Manufacturer s EH 2005, June Date code (YM) Pin 1 BCW66 Type code 4 0.9 3.15 12 BAT54... 1 ±0.1 0.1 MAX 0.2 1.15 2011-06-29 ...
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... Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Package SOT323 2 ±0.2 0.1 MAX. +0.1 3x 0.3 -0.05 0 0.65 0.65 0.2 0.6 0.65 0.65 Manufacturer 2005, June Date code (YM) BCR108W Pin 1 Type code 0.2 4 Pin 1 2.15 13 BAT54... 0.9 ±0.1 0.1 A +0.1 0.15 -0. 1.1 2011-06-29 ...
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... For board assembly information please refer to Infineon website "Packages" Copper Marking Layout (Example) Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) Cathode marking Package TSLP-2-7 Bottom view +0.01 0.39 -0.03 0.6 0.05 MAX 0.5 ±0.035 0.6 0.45 Solder mask Stencil apertures BAR90-02LRH Type code Cathode marking Laser marking 0.5 4 0.76 14 BAT54... ±0.05 2011-06-29 ...
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... Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. 15 BAT54... 2011-06-29 ...