BAS70 Infineon Technologies, BAS70 Datasheet - Page 22

• Manufacturer Part Number: BAS70
• Manufacturer: Infineon Technologies

Specifications of BAS70

• Packages: SOT23
• Configuration: Single
• Vr (max): 70.0 V
• If (max): 70.0 mA
• Ct (max): 2.0 pF
• Vf (max): 1,000.0 mV

Package Outline
Foot Print
For board assembly information please refer to Infineon website "Packages"
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
1
2
Cathode
marking
Top view
1) Dimension applies to plated terminal
Cathode
marking
Copper
0.6
Package TSLP-2-1
Solder mask
0.05 MAX.
0.76
4
0.4
+0.1
22
Stencil apertures
0.5
0.45
±0.035
0.5
BAS16-02L
Type code
Cathode marking
Laser marking
1)
Bottom view
2
1
0.6
±0.05
BAS70.../BAS170W
2007-09-19