NESW157B Nichia, NESW157B Datasheet - Page 6

• Manufacturer Part Number: NESW157B
• Manufacturer: Nichia

Specifications of NESW157B

• Size Lxwxh (mm): 3.0x1.4x0.52
• Lumi-nous Inten-sity Typ(cd): 6.7
• Lumi-nous Flux Typ(lm)): 20.0
• Forward Voltage Vf(v) Typ: 2.90
• Forward Voltage Vf(v) Max: 3.10
• Directivity (degree): 120
• If (ma): 50
• Mounting Style: Through Hole

SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
• Recommended Soldering Pad Pattern
* This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
* When soldering, do not apply stress to the LED while the LED is hot.
caused by heat and/or atmosphere.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
1 to 5°C per sec
0.6
Pre-heat
180 to 200°C
120sec Max
1.66
60sec Max
Above 220°C
0.5
0.64
260°C Max
10sec Max
0.6
• Recommended Metal Solder Stencil Aperture
• Recommended Hand Soldering Condition
0.6
0.8
Temperature
Soldering Time
1.56
2.4
350°C Max
3sec Max
0.7
0.54
0.8
0.6
(単位 Unit: mm)
5