74LCX244 Fairchild Semiconductor, 74LCX244 Datasheet

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74LCX244

Manufacturer Part Number
74LCX244
Description
Manufacturer
Fairchild Semiconductor
Datasheet

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© 2004 Fairchild Semiconductor Corporation
74LCX244WM
(Note 2)
74LCX244SJ
(Note 2)
74LCX244BQX
(Note 3)
74LCX244MSA
(Note 2)
74LCX244MTC
(Note 2)
Order Number
74LCX244
Low Voltage Buffer/Line Driver
with 5V Tolerant Inputs and Outputs
General Description
The LCX244 contains eight non-inverting buffers with
3-STATE outputs. The device may be employed as a mem-
ory address driver, clock driver and bus-oriented transmit-
ter/receiver. The LCX244 is designed for low voltage (2.5V
or 3.3V) V
5V signal environment.
The LCX244 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Ordering Code:
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 3: DQFN package available in Tape and Reel only.
CC
applications with capability of interfacing to a
MLP020B
Package
Number
MSA20
MTC20
M20D
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241,
2.5 x 4.5mm
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
DS500107
Features
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V
resistor is determined by the current-sourcing capability of the driver.
5V tolerant inputs and outputs
2.3V to 3.6V V
6.5 ns t
Power down high impedance inputs and outputs
Supports live insertion/withdrawal (Note 1)
Implements patented noise/EMI reduction circuitry
Latch-up performance exceeds 500 mA
ESD performance:
Human body model
Machine model
Leadless DQFN package
24 mA output drive (V
Package Description
PD
max (V
CC
CC
through a pull-up resistor: the minimum value or the
CC
specifications provided
200V
2000V
3.3V), 10 A I
CC
3.0V)
February 1994
Revised February 2004
CC
www.fairchildsemi.com
max

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74LCX244 Summary of contents

Page 1

... MLP020B 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, (Note 3) 2.5 x 4.5mm 74LCX244MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide (Note 2) 74LCX244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide (Note 2) Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “ ...

Page 2

Logic Symbol IEEE/IEC Connection Diagrams Pin Assignments for SOIC, SOP, SSOP, and TSSOP Pad Assignments for DQFN (Top Through View) www.fairchildsemi.com Pin Descriptions Pin Names Description 3-STATE Output Enable Inputs – I Inputs 0 ...

Page 3

Absolute Maximum Ratings Symbol Parameter V Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Source/Sink Current Supply ...

Page 4

DC Electrical Characteristics Symbol Parameter I Quiescent Supply Current CC I Increase in I per Input CC CC Note 7: Outputs disabled or 3-STATE only. AC Electrical Characteristics Symbol Parameter t Propagation Delay PHL t Data to Output PLH t ...

Page 5

AC LOADING and WAVEFORMS FIGURE 1. AC Test Circuit (C Test PLH PHL PZL PLZ PZH PHZ Waveform for Inverting and Non-Inverting Functions Propagation Delay. Pulse Width and t rec 3-STATE ...

Page 6

Schematic Diagram Generic for LCX Family www.fairchildsemi.com FIGURE 3. 6 ...

Page 7

Tape and Reel Specification Tape Format for DQFN Package Tape Designator Section Leader (Start End) BQX Carrier Trailer (Hub End) TAPE DIMENSIONS inches (millimeters) REEL DIMENSIONS inches (millimeters) Tape Size A B 13.0 0.059 12 mm (330.0) (1.50) Number Cavity ...

Page 8

Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide www.fairchildsemi.com Package Number M20B 8 ...

Page 9

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D 9 www.fairchildsemi.com ...

Page 10

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm www.fairchildsemi.com Package Number MLP020B 10 ...

Page 11

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide Package Number MSA20 11 www.fairchildsemi.com ...

Page 12

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves ...

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