MC74LVX50DT ON Semiconductor, MC74LVX50DT Datasheet - Page 6

• Manufacturer Part Number: MC74LVX50DT
• Description: IC BUFFER HEX NON-INVERT 14TSSOP
• Manufacturer: ON Semiconductor
• Series: 74LVXr

Specifications of MC74LVX50DT

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 6
• Number Of Bits Per Element: 1
• Current - Output High, Low: 4mA, 4mA
• Voltage - Supply: 2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

11. A
0.50 mm max. The component cannot rotate more than 10 within the determined cavity
0
10
, B
BENDING RADIUS
0
, and K
INCLUDING DRAFT AND RADII
FOR MACHINE REFERENCE
CONCENTRIC AROUND B
MAXIMUM COMPONENT ROTATION
0
are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
ONLY
B
1
TYPICAL
COMPONENT CAVITY
CENTER LINE
TYPICAL
COMPONENT
CENTER LINE
R MIN.
TAPE AND COMPONENTS
SHALL PASS AROUND RADIUS “R”
WITHOUT DAMAGE
NOTE
SEE
K
t
11
0
K
COVER
0
TAPE
TOP
Figure 6. Carrier Tape Specifications
ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250
USER DIRECTION OF FEED
D
http://onsemi.com
MC74LVX50
EMBOSSMENT
+
6
B
A
0
P
0
100 mm
(3.937”)
SEE NOTE 11
P
EMBOSSED
CARRIER
2
P
+
0
1 mm MAX
CAMBER (TOP VIEW)
OF CAVITY
10 PITCHES
CUMULATIVE
TOLERANCE ON
TAPE
( 0.008”)
CENTER
0.2 mm
+
LINES
(0.039”) MAX
*TOP COVER
TAPE THICKNESS (t
0.10 mm
(0.004”) MAX.
E
F
1 mm
W
D
FOR COMPONENTS
2.0 mm
AND LARGER
1
EMBOSSMENT
TAPE
250 mm
(9.843”)
1.2 mm
1
)
mm