MC74VHC244DTG ON Semiconductor, MC74VHC244DTG Datasheet - Page 7

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MC74VHC244DTG

Manufacturer Part Number
MC74VHC244DTG
Description
IC BUFF/DVR DUAL N-INV 20TSSOP
Manufacturer
ON Semiconductor
Series
74VHCr
Datasheet

Specifications of MC74VHC244DTG

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
8mA, 8mA
Voltage - Supply
2 V ~ 5.5 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Package
20TSSOP
Logic Family
VHC
Logic Function
Buffer/Line Driver
Number Of Outputs Per Chip
8
Output Type
3-State
Input Signal Type
Single-Ended
Maximum Propagation Delay Time @ Maximum Cl
11.9@3.3V|7.5@5V ns
Polarity
Non-Inverting
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
e
20
1
0.13 (0.005)
Z
b
M
D
0.10 (0.004)
11
10
E
A
H
E
A
1
OUTLINE DIMENSIONS
VIEW P
http://onsemi.com
SOIC EIAJ- -20
CASE 967--01
M SUFFIX
ISSUE O
M
_
L
E
7
L
DETAIL P
Q
1
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. TERMINAL NUMBERS ARE SHOWN FOR
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
Y14.5M, 1982.
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
H
A
L
M
A
b
c
D
E
e
L
Q
Z
E
E
1
1
12.35
MILLIMETERS
MIN
0.05
0.35
0.18
5.10
7.40
0.50
1.10
0.70
------
------
0
1.27 BSC
_
12.80
MAX
10
2.05
0.20
0.50
0.27
5.45
8.20
0.85
1.50
0.90
0.81
_
0.002
0.014
0.007
0.486
0.201
0.291
0.020
0.043
0.028
MIN
------
------
0
0.050 BSC
INCHES
_
MAX
0.081
0.008
0.020
0.011
0.504
0.215
0.323
0.033
0.059
0.035
0.032
10
_

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