HVL147 Renesas Electronics Corporation., HVL147 Datasheet

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... Adopting the trench structure improves low capacitance 0.31 pF max) Low forward resistance. (rf = 1.5 Low operation current. Extremely small Flat Lead Package (EFP) is suitable for surface mount design. Ordering Information Type No. HVL147 Pin Arrangement Rev.3.00 Jan 13, 2006 page max) Laser Mark Package Name ...

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... HVL147 Absolute Maximum Ratings Item Reverse voltage Forward current Power dissipation Junction temperature Storage temperature Electrical Characteristics Item Symbol Reverse current I R Forward voltage V F Capacitance C Forward resistance ESD-Capability * — Notes 1. Failure criterion ; I 100 For EFP package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is considered as unquestioned ...

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... HVL147 Main Characteristic - 75° - 0.2 0.4 Forward voltage V Fig.1 Forward current vs. Forward voltage 10 1.0 0 Reverse voltage V Fig.3 Capacitance vs. Reverse voltage Rev.3.00 Jan 13, 2006 page - 25°C -11 10 -12 10 -13 10 -14 10 0.6 0.8 1.0 (V) F Fig.2 Reverse current vs. Reverse voltage ...

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... HVL147 Package Dimensions Package Name JEITA Package Code RENESAS Code  EFP PXSF0002ZA Rev.3.00 Jan 13, 2006 page Previous Code MASS[Typ.] EFP / EFPV 0.0007g φ Pattern of terminal position areas Dimension in Millimeters Reference Symbol Min Nom Max A 0.44 0.47 0.50 b 0.25 0.30 0.35 c ...

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Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead ...