HVL368C Renesas Electronics Corporation., HVL368C Datasheet
![no-image](/images/manufacturer_photos/0/5/561/renesas_electronics_corporation__sml.jpg)
HVL368C
Related parts for HVL368C
HVL368C Summary of contents
Page 1
... Features Narrow terminal Capacitance deviation. Low series resistance 1.1 s Good C-V linearity. Extremely small Flat Lead Package (EFP) is suitable for surface mount design. Ordering Information Type No. HVL368C Pin Arrangement Rev.2.00 Mar 10, 2006 page max) Laser Mark Package Name C Cathode mark Mark ...
Page 2
... HVL368C Absolute Maximum Ratings Item Reverse voltage Junction temperature Storage temperature Electrical Characteristics Item Symbol Reverse current Capacitance Capacitance ratio n Series resistance r S Note For EFP package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is considered as unquestioned ...
Page 3
... HVL368C Main Characteristic –10 10 –11 10 –12 10 –13 10 – Reverse voltage V Fig.1 Reverse current vs. Reverse voltage 1.2 1.0 0.8 0.6 0.4 0.2 0 0.1 1.0 Reverse voltage V Fig.3 Series resistance vs. Reverse voltage Rev.2.00 Mar 10, 2006 page 0.1 (V) R Fig.2 Capacitance vs. Reverse voltage f = 470MHz 10 ( 1MHz 1 ...
Page 4
... HVL368C Package Dimensions Package Name JEITA Package Code RENESAS Code EFP PXSF0002ZA Rev.2.00 Mar 10, 2006 page Previous Code MASS[Typ.] EFP / EFPV 0.0007g φ Pattern of terminal position areas Dimension in Millimeters Reference Symbol Min Nom Max A 0.44 0.47 0.50 b 0.25 0.30 0.35 c ...
Page 5
Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead ...