MC74HC244ADWR2G ON Semiconductor, MC74HC244ADWR2G Datasheet - Page 4

IC BUFF/DVR TRI-ST DUAL 20SOIC

MC74HC244ADWR2G

Manufacturer Part Number
MC74HC244ADWR2G
Description
IC BUFF/DVR TRI-ST DUAL 20SOIC
Manufacturer
ON Semiconductor
Series
74HCr
Datasheet

Specifications of MC74HC244ADWR2G

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Logic Family
74HC
Number Of Channels Per Chip
Octal
Polarity
Non-Inverting
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
125 C
Mounting Style
SMD/SMT
High Level Output Current
- 7.8 mA
Input Bias Current (max)
4 uA
Low Level Output Current
7.8 mA
Maximum Power Dissipation
500 mW
Minimum Operating Temperature
- 55 C
Number Of Lines (input / Output)
3
Output Type
3-State
Propagation Delay Time
96 ns @ 2 V or 50 ns @ 3 V or 18 ns @ 4.5 V or 15 ns @ 6 V
Logical Function
Buffer/Line Driver
Number Of Elements
2
Number Of Channels
8
Number Of Inputs
8
Number Of Outputs
8
Operating Supply Voltage (typ)
2.5/3.3/5V
Package Type
SOIC W
Operating Supply Voltage (max)
6V
Operating Supply Voltage (min)
2V
Quiescent Current
4uA
Technology
CMOS
Pin Count
20
Mounting
Surface Mount
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74HC244ADWR2GOS
MC74HC244ADWR2GOS
MC74HC244ADWR2GOSTR
NOTE: Information on typical parametric values and high frequency or heavy load considerations can be found in Chapter 2 of the ON
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON
* Used to determine the no−load dynamic power consumption: P
DC ELECTRICAL CHARACTERISTICS
AC ELECTRICAL CHARACTERISTICS
Symbol
Symbol
ON Semiconductor High−Speed CMOS Data Book (DL129/D).
t
t
t
t
t
t
t
C
C
V
t
PLH
TLH
I
I
PLZ
PZL
PHL
PHZ
PZH
THL
C
I
OZ
CC
OL
out
PD
in
in
,
,
,
,
Semiconductor High−Speed CMOS Data Book (DL129/D).
Semiconductor High−Speed CMOS Data Book (DL129/D).
Power Dissipation Capacitance (Per Buffer)*
Maximum Low−Level Output
Voltage
Maximum Input Leakage Current
Maximum Three−State Leakage
Current
Maximum Quiescent Supply Cur-
rent (per Package)
Maximum Propagation Delay, A to YA or B to YB
Maximum Propagation Delay, Output Enable to YA or YB
Maximum Propagation Delay, Output Enable to YA or YB
Maximum Output Transition Time, Any Output
Maximum Input Capacitance
Maximum Three−State Output Capacitance
(Figures 1 and 3)
(Figures 2 and 4)
(Figures 2 and 4)
(Figures 1 and 3)
(Output in High−Impedance State)
Parameter
Parameter
(Voltages Referenced to GND)
(C
L
V
|I
V
V
Output in High−Impedance State
V
V
V
I
= 50 pF, Input t
out
out
in
in
in
in
out
in
= V
= V
= V
= V
= V
| v 20 mA
= 0 mA
= V
IL
IL
CC
IL
CC
CC
Test Conditions
http://onsemi.com
or V
|I
|I
|I
or GND
or GND
out
out
out
or GND
IH
| v 2.4 mA
| v 6.0 mA
| v 7.8 mA
r
D
= t
= C
4
f
= 6 ns)
PD
V
CC
2
f + I
CC
V
V
V
2.0
4.5
6.0
3.0
4.5
6.0
6.0
6.0
6.0
2.0
3.0
4.5
6.0
2.0
3.0
4.5
6.0
2.0
3.0
4.5
6.0
2.0
3.0
4.5
6.0
CC
V
V
CC
CC
. For load considerations, see Chapter 2 of the
– 55 to
– 55 to
25_C
25_C
± 0.1
± 0.5
Typical @ 25°C, V
0.26
0.26
0.26
110
110
0.1
0.1
0.1
4.0
96
50
18
15
60
22
19
60
22
19
60
23
12
10
10
15
Guaranteed Limit
Guaranteed Limit
v 85_C
v85_C
± 1.0
± 5.0
0.33
0.33
0.33
115
140
140
0.1
0.1
0.1
40
60
23
20
70
28
24
70
28
24
75
27
15
13
10
15
34
CC
v 125_C
= 5.0 V
v125_C
± 1.0
± 10
160
135
165
165
0.1
0.1
0.1
0.4
0.4
0.4
70
27
23
80
33
28
80
33
28
90
32
18
15
10
15
Unit
Unit
mA
mA
mA
pF
pF
pF
ns
ns
ns
ns
V

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