BAS386 Vishay, BAS386 Datasheet
BAS386
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BAS386 Summary of contents
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... Thermal Characteristics °C, unless otherwise specified amb Parameter Junction to ambient air on PC board 1.6 mm Junction temperature Storage temperature range Document Number 85505 Rev. 1.9, 07-Mar-06 e2 Ordering code BAS386-TR3 or BAS386-TR Test condition Symbol FSM I FRM FAV Test condition ...
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... BAS386 Vishay Semiconductors Electrical Characteristics °C, unless otherwise specified amb Parameter Forward voltage 100 mA F Reverse current Diode capacitance MHz R Typical Characteristics °C, unless otherwise specified amb ...
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... Reflow Soldering 0.8 (0.031) 0.8 (0.031) 2.4 (0.094) Document No.: 6.560-5007.01-4 Rev. 11, 07.Feb.2005 9612072 Document Number 85505 Rev. 1.9, 07-Mar-06 1.27 9.9 Glass case MicroMELF 0.25 (0.010) 0.15 (0.006) > R 2.5 (R 0.098) Glass Wave Soldering 0.9 (0.035) 0.8 (0.031) 1.0 (0.039) 2.8 (0.110) BAS386 Vishay Semiconductors ISO Method E 0.9 (0.035) www.vishay.com 3 ...
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... BAS386 Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment ...
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... Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right ...