CMH05A TOSHIBA Semiconductor CORPORATION, CMH05A Datasheet
CMH05A
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CMH05A Summary of contents
Page 1
... R th (j-a) (soldering land × 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 t) ⎯ (j-ℓ) 1 CMH05A JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Min Typ. ...
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... Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. Unit: mm 1.4 2 CMH05A 2006-11-08 ...
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... Soldering land: 6.0 mm × 6.0 mm board thickness: 1.6 t Device mounted on a ceramic board: board size × Soldering land: 2.0 mm × 2.0 mm board thickness: 0.64 t 0.1 0 Time t (s) 3 CMH05A P – (AV) F (AV) 0.4 0.6 0.8 1.0 1.2 1.4 (A) F (AV) Ta max – (AV) Device mounted on a glass-epoxy board: board size × ...
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... C – 100 Ta = 25° MHz Reverse voltage V (V) R (Typ 100 4 CMH05A Surge forward current (non-repetitive 25° 100 Number of cycles 2006-11-08 ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 CMH05A 20070701-EN 2006-11-08 ...