FM500V-NS FORMOSA MICROSEMI CO. LTD, FM500V-NS Datasheet - Page 6

• Manufacturer Part Number: FM500V-NS
• Description: Chip Schottky Barrier Diode
• Manufacturer: FORMOSA MICROSEMI CO. LTD

PACKAGE
SOD-323S
Reel packing
Suggested thermal profiles for soldering processes
Chip Schottky Barrier Diode
FM500V-NS
http://www.formosams.com/
TEL:[phone]
FAX:[phone]
3.Flow (wave)soldering (solder dipping)
1.Storage environment: Temperature=10 C~35 C Humidity=65%±15%
2.Reflow soldering of surface-mount devices
REEL SIZE
7"
T
T
25
T
Average ramp-up rate(T
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t
Tsmax to T
-Ramp-upRate
Time maintained above:
-Temperature(T
-Time(t
Peak Temperature(T
Time within 5 C of actual Peak
Temperature(t
Ramp-down Rate
Time 25 C to Peak Temperature
P
L
S
T
smin
T
REEL
(pcs)
5000
smax
L
o
)
Profile Feature
L
o
COMPONENT
P
)
SPACING
L
(m/m)
)
4.0
Preheat
s
t25
)
P
t
)
s
o
C
L
to Peak
to T
20,000
(pcs)
BOX
Ramp-up
Time
P
)
o
185*185*51
Page 6
INNER
(m/m)
BOX
o
Ramp-down
t
P
(m/m)
REEL
DIA,
178
Soldering Condition
t
L
255 C-0/+5 C
60~150sec
<3 C/sec
60~120sec
<6 C/sec
10~30sec
<6minutes
430*190*220
<3 C/sec
CARTON
o
o
100 C
150 C
183 C
o
(m/m)
SIZE
o
o
o
o
Critical Zone
Document ID
DS-121602
Wave Soldering
IR Reflow
o
T
L
to
Formosa MS
CARTON
T
Issued Date
2008/02/10
160,000
(pcs)
P
Revised Date
-
GROSS WEIGHT
APPROX.
Revision
(kg)
4.9
A
Page.
7