DDB2503-000 Skyworks Solutions, Inc., DDB2503-000 Datasheet - Page 2

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DDB2503-000

Manufacturer Part Number
DDB2503-000
Description
Silicon Schottky Barrier Diodes Packaged, Bondable Chips And Beam-leads
Manufacturer
Skyworks Solutions, Inc.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DDB2503-000
Manufacturer:
Skyworks
Quantity:
1 400
Part Number:
DDB2503-000LF
Manufacturer:
Skyworks
Quantity:
1 400
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS
Assembly and Handling Procedure
Die Attach Methods
Universal chips are compatible with both eutectic and conductive
epoxy die attach methods.
Eutectic composition performs of Au/Sn or Au/Ge are useful when
soldering devices in circuit. Gold/silicon eutectic die attach can
be accomplished by scrubbing the chip directly to the gold plated
bonding area.
Epoxy die attach with silver or gold filled conductive epoxies can
also be used where thermal heat sinking is not a requirement.
Beam-Lead P-Type Detector Schottky Diodes
1. Bias = 50 µA.
2. Video bandwidth = 10 MHz.
3. Bias = 30 µA.
P-Type Detector Schottky Diode Universal Chips
1. Bias = 50 µA.
2. Video bandwidth = 10 MHz.
3. Bias = 30 µA.
4. R
2
Epoxy and Hermetic Packaged Beam-Lead P-Type Detector Schottky Diodes
Frequency
V
Frequency
= 2800 W.
Band
Ku
K
Band
X
Ku
K
DDB2503–000
DDB2504–000
DDB2265–000
epoxy Stripline
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
DDB2503-250
DDB2504-250
DDB2265-250
October 3, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200847 Rev. A
number
Part
CDB7620–000
CDB7619–000
250
number
Part
dBm
tss –
typ.
50
50
48
3
1,2
dBm
tss –
min.
50
40
1,2,4
3
800
min.
500
500
3
(W)
r
V
c
electrical characteristics
J
max.
0.15
0.10
1200
(pF)
max.
@ 0V
700
700
epoxy Stripline
DDB2503-230
DDB2504-230
DDB2265-230
3
230
electrical characteristics
Wire Bonding
Two methods can be used to connect wire, ribbon, and wire mesh
to the chips:
l
l
Skyworks recommends use of pure gold wire
(0.7–1.25 mil diameter).
Thermocompression
Ballbonding
c
J
max.
0.15
0.10
0.10
(pF)
250–350
300–450
@ 1 ma
@ 0V
(mv)
V
F
200–350
200–350
300–450
@ 1 ma
(mv)
V
F
@ 10 ma
max.
(W)
30
40
r
t
@ 10 ma
(V)
V
2
2
3
B
hermetic Stripline
@ 10 ma
DDB2503-220
DDB2504-220
DDB2265-220
min.
(V)
V
2
3
conditions
B
Frequency
220
(ghz)
24.15
test
10
16
Drawing
571–006
571–006
outline
491–006
491–006
491–006
Drawing
outline

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