MCP14E4 Microchip Technology Inc., MCP14E4 Datasheet - Page 16

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MCP14E4

Manufacturer Part Number
MCP14E4
Description
4.0a Dual High-speed Power Mosfet Drivers With Enable
Manufacturer
Microchip Technology Inc.
Datasheet

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0
MCP14E3/MCP14E4/MCP14E5
DS22062A-page 16
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
Model Draft Angle Top
NOTE 1
A
A1
N
φ
1
TOP VIEW
2
D1
D
A2
Dimension Limits
E1
E
EXPOSED
A3
Units
A2
A1
A3
D1
D2
E1
E2
PAD
N
D
e
A
E
b
L
K
φ
NOTE 2
b
MIN
0.00
3.85
2.16
0.35
0.50
0.20
BOTTOM VIEW
D2
MILLIMETERS
2
1.27 BSC
0.20 REF
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
e
NOM
0.85
0.65
0.01
4.00
2.31
0.40
0.60
1
8
Microchip Technology Drawing C04-113B
N
E2
© 2007 Microchip Technology Inc.
NOTE 1
K
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12°
L

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