MCP6S22 Microchip Technology Inc., MCP6S22 Datasheet - Page 33

• Manufacturer Part Number: MCP6S22
• Description: Single-ended, Rail-to-rail I/o, Low Gain Pga
• Manufacturer: Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
2003 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint (Reference)
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Drawing No. C04-111
p
c
B
n
§
(F)
Dimension Limits
E1
E
Units
A2
A1
E1
A
E
D
B
n
p
L
F
c
MIN
.030
.002
.184
.114
.114
.016
.035
.004
.010
0
2
1
INCHES
NOM
.026
L
D
.034
.193
.118
.118
.022
.037
.006
.012
8
7
7
A
MAX
A1
.044
.038
.006
.200
.122
.122
.028
.039
.008
.016
6
MCP6S21/2/6/8
MIN
0.76
0.05
4.67
2.90
2.90
0.40
0.90
0.10
0.25
0
MILLIMETERS*
NOM
0.65
4.90
0.86
3.00
3.00
0.55
0.95
0.15
0.30
7
7
DS21117A-page 33
8
MAX
.5.08
1.18
0.97
0.15
3.10
3.10
0.70
1.00
0.20
0.40
A2
6