IC-LSOBGALS2C iC-Haus, IC-LSOBGALS2C Datasheet - Page 3

• Manufacturer Part Number: IC-LSOBGALS2C
• Description: Photosensor Package Specification
• Manufacturer: iC-Haus

iC-LS oBGA LS2C
PHOTOSENSOR PACKAGE SPECIFICATION
DIMENSION TABLE
Item
G3
M1
M2
M3
M4
A1
A2
A3
H1
H2
H3
H4
E1
J5
J6
J7
L1
L2
L3
T1
T2
T3
T5
Parameter
Substrate
Outline X
Outline Y
Substrate Thickness
Chip Placement
Chip Thickness
Sensor Array Position
vs. Bottom Metal X
Sensor Array Position
vs. Bottom Metal Y
Parallelism Sensor Array
vs. Bottom Metal
Bottom Metal Pattern
Lead Diameter
Lead Pitch X
(or Lead-Lead Distance X)
Lead Pitch Y
(or Lead-Lead Distance Y)
Glass/Reticle Cover
Glass/Reticle Size X
Glass/Reticle Size Y
Glass/Reticle Thickness
Glass/Reticle Position
vs. Bottom Metal X
Glass/Reticle Position
vs. Bottom Metal Y
Parallelism Reticle-Pattern
vs. Bottom Metal
Encapsulation
Coating Excess
Thickness Specifications
Overall Thickness
Solder Ball Height
Solder Ball Coplanarity
Solder Ball Diameter
Comments
bottom package to bottom die
center of array
center of outermost trace
iC-LSA
iC-LSB
iC-LSC
surface glass to surface coating
bottom substrate to top of glass
(nominal glass cover thickness
of 0.50 mm)
drawing not to scale
Min.
1.50
0.36
0.635
0.635
Typ.
0.87
0.30
1.05
1.84
0.50
1.10
1.84
2.64
1.36
6.2
5.2
2.5
1.0
1.0
2.5
Max.
0.15
0.05
1.85
0.1
0.5
Rev A4, Page 3/5
Tolerance
±0.15
±0.15
±0.03
±0.05
±0.1
±0.1
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm