EVB71121 Melexis Company, EVB71121 Datasheet - Page 16

• Manufacturer Part Number: EVB71121
• Description: Evaluation Board For Mlx71121
• Manufacturer: Melexis Company

6
This Melexis device is classified and qualified regarding soldering technology, solderability and moisture
sensitivity level, as defined in this specification, according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
Iron Soldering THD’s (Through Hole Devices)
•
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualification of RoHS compliant products (RoHS = European directive on the Restriction Of
the Use of Certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality_leadfree.aspx
7
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
39012 71121 01
Rev. 003
IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)”
EIA/JEDEC JESD22-A113
“Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles
according to table 2)”
EN60749-20
“Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat”
EIA/JEDEC JESD22-B106 and EN60749-15
“Resistance to soldering temperature for through-hole mounted devices”
EN60749-15
“Resistance to soldering temperature for through-hole mounted devices”
EIA/JEDEC JESD22-B102 and EN60749-21
“Solderability”
Reliability Information
ESD Precautions
Page 16 of 18
Evaluation Board Description
300 to 930MHz Receiver
EVB71121
EVB Description
Jan/08