MC74LCX244DT ON Semiconductor, MC74LCX244DT Datasheet - Page 9

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MC74LCX244DT

Manufacturer Part Number
MC74LCX244DT
Description
IC BUFF/DVR TRI-ST DUAL 20TSSOP
Manufacturer
ON Semiconductor
Series
74LCXr
Datasheet

Specifications of MC74LCX244DT

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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e
20
1
0.13 (0.005)
Z
b
M
D
0.10 (0.004)
11
10
E
A
H
E
A
1
PACKAGE DIMENSIONS
VIEW P
http://onsemi.com
CASE 967−01
SOEIAJ−20
ISSUE A
M
_
L
9
E
L
DETAIL P
Q
1
c
NOTES:
1.
2.
3.
4.
5.
Y14.5M, 1982.
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
H
A
L
M
A
b
c
D
E
e
L
Q
Z
E
E
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE
TERMINAL NUMBERS ARE SHOWN FOR
THE LEAD WIDTH DIMENSION (b) DOES NOT
1
1
12.35
MILLIMETERS
MIN
0.05
0.35
0.15
5.10
7.40
0.50
1.10
0.70
---
---
0
1.27 BSC
_
12.80
MAX
10
2.05
0.20
0.50
0.25
5.45
8.20
0.85
1.50
0.90
0.81
_
0.002
0.014
0.006
0.486
0.201
0.291
0.020
0.043
0.028
MIN
---
---
0
0.050 BSC
INCHES
_
MAX
0.081
0.008
0.020
0.010
0.504
0.215
0.323
0.033
0.059
0.035
0.032
10
_

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